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Heat dissipation back clamp

A technology of a back clip and a heat dissipation mechanism, applied in the field of heat dissipation back clip, can solve the problems of easy intrusion of foreign objects, unsatisfactory heat dissipation efficiency of the heat dissipation back clip, etc., and achieves the effect of fast air flow rate, improved heat dissipation efficiency, and guaranteed heat dissipation efficiency.

Active Publication Date: 2021-04-02
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present application discloses a heat dissipation back clip, which can solve the problem of unsatisfactory heat dissipation efficiency of the heat dissipation back clip in the related art due to the fact that foreign objects are more likely to intrude into the heat dissipation back clip.

Method used

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Embodiment Construction

[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0026] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

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Abstract

The invention discloses a heat dissipation back clamp which comprises a back clamp main body (100) and a heat dissipation mechanism (200), the heat dissipation mechanism (200) is arranged on a first side of the back clamp main body (100), and a mounting space (110) for accommodating electronic equipment is formed in a second side of the back clamp main body (100); the heat dissipation mechanism (200) comprises a cover body (210), a fan (220), an air volume adjusting mechanism (230) and a first driving mechanism, the cover body (210) is arranged on the first side of the back clamp body (100), the cover body (210) and the back clamp body (100) form a containing space, the fan (220) is arranged in the containing space, and the cover body (210) is provided with a ventilation hole. The air volume adjusting mechanism (230) is arranged on the ventilation hole, and the first driving mechanism is connected with the air volume adjusting mechanism (230). The first driving mechanism can drive theair volume adjusting mechanism (230) to move so as to adjust the opening degree of the ventilation hole. According to the scheme, the problem that the heat dissipation efficiency of the heat dissipation back clamp is not ideal due to the fact that foreign matter invades easily can be solved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation back clips, in particular to a heat dissipation back clip. Background technique [0002] With the improvement of user needs, the performance of electronic equipment continues to be optimized. The current electronic devices have gradually developed from communication tools to social entertainment tools. Correspondingly, electronic devices have also taken on the responsibility of more scene applications, such as charging, games, video, and photography. [0003] Due to the optimization of the performance of the electronic equipment and the increase of its functions, the electronic equipment will generate more heat during the working process, which will lead to overheating of the electronic equipment. [0004] In order to solve the problem of overheating, currently users usually equip electronic devices with heat dissipation back clips. During the use of electronic equipment, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145H05K7/2039
Inventor 麦碧权高志稳
Owner VIVO MOBILE COMM CO LTD
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