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Photoinitiator composition, photosensitive solder resist composition containing same, and printed circuit board

A photoinitiator, photosensitive solder resist technology, applied in printed circuits, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of high reactivity, easy ink reaction, and reduced ink storage stability.

Inactive Publication Date: 2021-04-09
深圳市容大感光科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with 907, this kind of photoinitiator has disadvantages that cannot be ignored: on the one hand, due to the extremely high photosensitivity, the ink is more likely to react during production and use, which affects the quality of the ink; on the other hand, the photoinitiator Photoinitiators are sensitive to water and heat, and their high reactivity can easily trigger monomer reactions, which will lead to reduced storage stability and shortened service life of the ink.
In addition, this type of photoinitiator is expensive, and applying it to ordinary photosensitive solder resist compositions will lead to a substantial increase in cost

Method used

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  • Photoinitiator composition, photosensitive solder resist composition containing same, and printed circuit board
  • Photoinitiator composition, photosensitive solder resist composition containing same, and printed circuit board
  • Photoinitiator composition, photosensitive solder resist composition containing same, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5 and comparative Embodiment 1-4

[0123] Main ingredient: mix the photosensitive resin A prepared above with other components according to the main ingredient formula shown in Table 1, disperse for 20 minutes with a high-speed disperser (Qinkai U400\80-220, the same below), and then use A three-roll mill (Chile S-65 three-roll mill, the same below) grinds to a particle size of less than 10 μm (detected by a scraper fineness meter (Jinfulun QXP-100ISO, the same below)) to obtain the ink main agent.

[0124] Curing agent: The curing agent formula shown in the following table 1, mix each component evenly, disperse at high speed with a disperser for 10 minutes, and then grind with a three-roll mill until the particle size is less than 10 μm (detected by a scraper fineness meter ), to obtain the ink curing agent component.

[0125] Mix the main ingredient with the curing agent before use, stir evenly before use.

[0126] Table 1

[0127]

[0128] Note 1: Pigment, phthalocyanine green L9361 purchased from BASF ...

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Abstract

The present invention relates to a photoinitiator composition comprising: an acylphosphine oxide-based photoinitiator and an oxime ester-based photoinitiator, in which the weight ratio of the acylphosphine oxide-based photoinitiator to the oxime ester-based photoinitiator is 0.5-150: 1, preferably 1-120: 1, more preferably 5-100: 1, most preferably 10-90: 1. The invention also relates to a photosensitive solder resist composition containing the photoinitiator composition and application of the photosensitive solder resist composition. In addition, the invention also provides a circuit board comprising the cured film formed by the photosensitive solder resist composition.

Description

technical field [0001] The invention belongs to the field of photosensitive materials. Specifically, the present invention relates to a photoinitiator composition, a photosensitive solder resist composition containing the same, and a printed circuit board. Background technique [0002] The photo solder resist composition is a permanent protective film covering the surface of the printed circuit board. On the one hand, the protective film can prevent unnecessary solder adhesion in the subsequent plug-in, patch and other processes, and prevent short circuits; Short circuit due to aging (temperature, humidity, vibration, etc.) during subsequent use. [0003] The photosensitive solder resist composition is used to make patterns by photocuring, and then on the basis of photocuring, further improve various properties of the solder resist coating film by thermal curing, so as to meet application requirements. In the photocuring process, a photoinitiator is used to initiate a pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/48G03F7/027G03F7/004H05K3/28
CPCC08F2/48G03F7/027G03F7/004H05K3/282H05K3/287
Inventor 王桥杨遇春
Owner 深圳市容大感光科技股份有限公司
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