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Low-silicon high-thermal-conductivity die-casting aluminum alloy and preparation method thereof

A technology of casting aluminum alloy and high thermal conductivity, which is applied in the field of aluminum alloy materials, can solve the problems that the thermal conductivity of aluminum alloy and die-casting process cannot be improved at the same time, and achieve the effects of avoiding deformation, reducing adverse effects, and increasing fluidity

Active Publication Date: 2021-04-09
重庆慧鼎华创信息科技有限公司 +1
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Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a low-silicon high-thermal conductivity die-casting aluminum alloy and its preparation method to solve the problem that the prior art cannot simultaneously improve the thermal conductivity of the aluminum alloy and the die-casting manufacturability

Method used

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with embodiment.

[0026] 1. A low silicon high thermal conductivity die-casting aluminum alloy

[0027] The low-silicon and high-thermal-conductivity die-casting aluminum alloy of the present invention is calculated by mass percentage, and includes the following components:

[0028] Si is 1.5%-3%; Fe is 0.4%-1.3%; Sr is 0-0.1%; 0-1% RE is also included; impurity elements are less than 0.15%; the balance is Al.

[0029] Wherein, the RE is a rare earth element, and the RE is one or more of La, Ce and Sm. Said RE is further preferably Ce.

[0030] In specific implementation, the die-casting aluminum alloy is calculated by mass percentage and includes the following components: 1.8%-2.3% of Si; 0.6%-0.82% of Fe; 0.1%-0.5% of RE; 0.02-0.06% of Sr ; The sum of other impurities is less than 0.15%, and the rest is Al. Among them, Cu, Mn, Zn, Mg, Ni are also included, and the mass percentage of their indivi...

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Abstract

The invention discloses a low-silicon high-thermal-conductivity die-casting aluminum alloy and a preparation method thereof. The low-silicon high-thermal-conductivity die-casting aluminum alloy is prepared from, by mass percentage, 1.5-3% of Si, 0.4-1.3% of Fe, 0-0.1% of Sr, 0-1% of RE, 0-0.15% of impurity elements, and the balance Al. According to the preparation method, the content of Si and the content of Fe are adjusted to be kept in a low-content state, and the adverse effect of Si and Fe on the thermal conductivity of the aluminum alloy is reduced; and meanwhile, the aluminum alloy remains high die-casting manufacturability, and die-casting can be conducted at the temperature of 670-720 DEG C.

Description

technical field [0001] The invention relates to the technical field of aluminum alloy materials, in particular to a die-casting aluminum alloy with low silicon and high thermal conductivity and a preparation method thereof. Background technique [0002] At present, 3C products, automotive communication electronics and other fields are facing increasing pressure to reduce weight. At the same time, some components often have higher requirements on the thermal conductivity of materials, especially heat dissipation devices, in order to ensure and improve product life and work stability. [0003] Aluminum alloy has good comprehensive properties, and its advantages such as low density, high strength, good electrical and thermal conductivity, and simple processing can better meet the product structure and heat dissipation requirements, so it is widely used in the fields of automobiles, electronics, and communications. The thermal conductivity of pure aluminum at room temperature i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C1/02C22F1/043
CPCC22C21/02C22C1/026C22F1/043
Inventor 宋成猛
Owner 重庆慧鼎华创信息科技有限公司
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