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Shell packaging structure of IGBT module and method for detecting sealing performance of shell packaging structure
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A packaging structure and sealing technology, which can solve the problems of silicone gel leakage, IGBT device scrapping, etc.
Pending Publication Date: 2021-04-09
XIAN YONGDIAN ELECTRIC
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[0002] At present, the shell mounting structure of the common soldered IGBT module is as follows: Figure 1-2 As shown, in order to realize the insulation, moisture-proof and buffering functions of the IGBT, the interior of the IGBT module is potted with silicone gel. During the silicone gel potting process, there is often a gap between the shell and the bottom plate, resulting in the silicone gel leaking from the gap, and then Leading to the scrapping of IGBT devices
However, at present, it is only possible to observe with the naked eye whether the glue leakage occurs after potting the silicone gel, and there is no effective way to prevent the occurrence of the above problems.
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Embodiment 1
[0028] The present invention provides a shell package structure of an IGBT module, see image 3 As shown, it includes a shell 1 , a bottom plate 2 is arranged under the shell 1 , and the shell 1 and the bottom plate 2 are fixed by an adhesive 3 ;
[0029] Further, the spraying method of the film layer 4 is atomized spraying.
[0030] Furthermore, the thickness of the film layer 4 is 50-100 μm.
Embodiment 2
[0032] On the basis of Embodiment 1, the present invention provides a method for detecting the airtightness of the housing packaging structure of the IGBT module, which is used for the detection of the sealing of the adhesive 3 between the housing 1 and the bottom plate 2 in the housing packaging structure, specifically including :
[0033] 1) Vacuum negative pressure: place the IGBT module coated with the film layer 4 in the vacuum equipment, seal the upper part of the casing 1 and pump the internal pressure to negative pressure, see Figure 4 ;
[0034] 2) Determine whether there is a gap between the shell 1 and the bottom plate 2 according to whether the film layer 4 is damaged: if the film layer 4 is damaged, there is a gap between the shell 1 and the bottom plate 2; if not, there is no gap between the shell 1 and the bottom plate 2.
[0035] Further, in step 1), the cover plate 5 is used to seal the upper part of the housing 1 .
[0036] In this detection method, the pr...
Embodiment 3
[0038] On the basis of Embodiment 1, the present invention provides another method for detecting the airtightness of the housing packaging structure of the IGBT module, which is used for the detection of the sealing of the adhesive 3 between the housing 1 and the bottom plate 2 in the housing packaging structure. Layer 4 is a gas-sensitive film layer, specifically including:
[0039] 1) Vacuum negative pressure: place the IGBT module coated with the gas-sensitive film layer in the vacuum equipment, seal the upper part of the casing 1 and fill it with inert gas, and pump the space pressure outside the IGBT module to negative pressure;
[0040] 2) Determine whether there is a gap between the shell 1 and the bottom plate 2 according to whether there is a reaction phenomenon in the gas-sensitive film layer. If yes, there is a gap between the shell 1 and the bottom plate 2. If not, there is no gap between the shell 1 and the bottom plate 2.
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Abstract
The invention belongs to the technical field of IGBT module packaging, and relates to a shell packaging structure of an IGBT module and a method for detecting the sealing performance of the shell packaging structure. The packaging structure comprises a shell, a bottom plate is arranged below the shell, and the shell and the bottom plate are fixed through an adhesive glue; the outer side of a connecting area of the shell and the bottom plate is coated with a film layer. According to the detection method, the internal space pressure of the shell is pumped to negative pressure, and if a gap exists between the bottom plate and the shell, the film layer at the gap is burst through due to the pressure difference between the inside and the outside of the shell after a certain period of time. And then, the IGBT module is taken out of the equipment, whether air holes exist in the film layer coating the outer side of the connection area of the shell and the bottom plate or not is observed, a gap can be effectively prevented from existing between the shell and the bottom plate, the IGBT module with the air holes returns to a previous procedure to be reinstalled, and the IGBT module without the air holes normally circulates.
Description
technical field [0001] The invention belongs to the technical field of IGBT module encapsulation, and relates to the detection of the sealing performance of the IGBT module, in particular to a shell encapsulation structure of the IGBT module and a method for detecting its airtightness. Background technique [0002] At present, the shell mounting structure of the common soldered IGBT module is as follows: Figure 1-2 As shown, in order to realize the insulation, moisture-proof and buffering functions of the IGBT, the interior of the IGBT module is potted with silicone gel. During the silicone gel potting process, there is often a gap between the shell and the bottom plate, resulting in the silicone gel leaking from the gap, and then Lead to the scrapping of IGBT devices. However, at present, it is only possible to observe with the naked eye whether the glue leakage occurs after potting the silicone gel, and there is no effective means to prevent the occurrence of the above-me...
Claims
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Application Information
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