Copper plating thickening process for printed circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to a copper plating and thickening process for printed circuit boards. By adopting a new type of cyclic plating process, the problem of uneven copper plating can be avoided while completing the thickening of copper plating, and combined with the optimization of the process and the adjustment of process parameters, a method for improving uneven copper plating, unclean etching, and ink can be obtained. The processing method with excessive side etching improves the production process capability, improves production efficiency, and reduces quality risks. This method can effectively solve the problem of difficult thickening of copper plating above 9oz, and avoid uneven copper plating and copper plating when electroplating thick copper. At the same time, through multiple etchings, the line burr can be improved to ensure that the etching will not be unclean and the burr is too large due to excessive copper thickness when making the circuit, thereby effectively solving the problem of copper thickness in solder mask printing. Too high, too large line burrs lead to problems such as ink bubbles, too large ink side erosion, etc., which greatly improves the quality of the product.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a copper plating and thickening process for printed circuit boards. Background technique [0002] With the rapid development of power communication technology, 4-10oz and above ultra-thick copper foil circuit boards have gradually become a type of special PCB with broad market prospects. In the process of electroplating, wiring, and solder mask production for power supply printed circuit boards, the copper thickness requirement is as high as 9oz, and the printed circuit board with a board thickness of 5.4mm has uneven copper plating and copper plating blockages during electroplating. Abnormalities such as holes; when making circuits, there are abnormalities such as unclean etching and excessive burrs due to excessive copper thickness; during solder mask printing, ink bubbles and ink side erosion are too large due to excessive copper thickness and excessive circui...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper plating thickening process for printed circuit boards. The technical solution provided by the present invention solves the problems of the existing printed circuit boards with relatively high copper thickness in the production process of electroplating, wiring, and solder resistance. There are problems such as uneven copper plating, copper plating blocking holes, dirty etching, excessive burr, ink bubbles, excessive ink side erosion, etc., and abnormal appearance

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