Copper plating thickening process for printed circuit board
A printed circuit and board copper plating technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve problems such as reliability and abnormal appearance, excessive ink side erosion, excessive burr, etc., to improve the production process ability, improve line burrs, and improve production efficiency
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0028] For printed circuit boards with a copper thickness of 9oz or more and a board thickness of 5.4mm, there are abnormalities such as uneven copper plating and copper-plated hole blocking during electroplating; Abnormalities such as excessive burrs; during solder mask printing, problems such as ink bubbles and excessive ink side erosion due to excessive copper thickness and excessive circuit burrs.
[0029] In order to solve the above-mentioned technical ...
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