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A sensing device and method for measuring three-dimensional contact stress

A technology of contact stress and sensing devices, which is applied in the direction of measuring devices, measuring forces, instruments, etc., can solve the problems of single interdigital electrodes of sensors, single application scenarios of sensors, unfavorable miniaturization, etc., and achieve diverse application scenarios and wide application range wide, conducive to the effect of miniaturization

Active Publication Date: 2021-11-26
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the interdigitated electrode of the sensor of the invention has a single form and a relatively complex structure, which leads to a single application scene of the sensor, which is not conducive to miniaturization

Method used

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  • A sensing device and method for measuring three-dimensional contact stress
  • A sensing device and method for measuring three-dimensional contact stress
  • A sensing device and method for measuring three-dimensional contact stress

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Embodiment Construction

[0042] The preferred embodiments of the present invention are given in conjunction with the accompanying drawings, and will be described in detail.

[0043] like figure 1 As shown, the present invention provides a sensing device for measuring the three-dimensional contact stress, and the signal direction is sequentially including the signal generator 10, the sensor 20, the conditioning circuit 30, and the host computer 40, wherein the signal generator 10 generates an intersection signal input. To the sensor 20, the sensor 20 is generated by the contact stress, the capacitance change input to the conditioned circuit 30 generates a corresponding voltage information, and the voltage information is input to the host computer 40, and the host computer 40 acquires three-dimensional contact stress based on the voltage information.

[0044] like figure 2 As shown, the sensor 20 is from bottom to include the electrode substrate 21, the fork finger electrode array 22, and the dielectric lay...

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Abstract

The invention provides a sensing device for measuring three-dimensional contact stress, which includes: a signal generator, a sensor, a conditioning circuit, and a host computer in sequence along the signal direction, and the sensor includes an electrode base, an interdigitated electrode array, and a dielectric layer in sequence from bottom to top The interdigital electrode array is fixed on the surface of the electrode base and is closely attached to the dielectric layer. The interdigital electrode array is composed of a plurality of interdigital electrodes, and each interdigital electrode includes a plurality of evenly arranged interdigital capacitance units. The sensing device of the invention has the advantages of simple and compact structure, high reliability, low cost and easy industrial production, and is beneficial to miniaturization, integration and flexibility at the same time. The invention also provides a method for measuring three-dimensional contact stress, which has a wide range of applications and various application scenarios, and provides new ideas for realizing application scenarios such as flexible grasping of robots and wearable equipment.

Description

Technical field [0001] The present invention relates to the field of contact stress measurement, and more particularly to a sensing device and method for measuring three-dimensional contact stress. Background technique [0002] The contact stress sensing device is used as a sensing device that mimics the haptic function in the robot. It is often only possible to obtain contact stress information perpendicular to the surface of the object to be detected when contacting the object to be tested, that is, the object to be tested can only be tested. Aware. In the application of the actual robot fine, the application of flexible wear devices, usually, it is often necessary to understand the information of the contact stress in the multi-dimensional direction. Restrictions on existing contact stress sensor stress sensing dimensions, the information of contact stress in the multi-dimensional direction requires multiple stress sensors to simultaneously capture the information of the conta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14
CPCG01L1/142
Inventor 沙金冯路杨润哲吴桐潘云飞谢林生马玉录
Owner EAST CHINA UNIV OF SCI & TECH