Vertical routing equipment and routing method

Abstract

The invention provides vertical routing equipment and a routing method. The equipment comprises: a chopper which is provided with a wire hole for a metal wire to pass through; a cutter aligned to a target cutting point on the outer side of the lower port of the chopper and used for cutting the metal wire from the target cutting point and melting the end of the metal wire to form a metal ball; and a moving device providing vertical movement of the chopper and the cutter, and enabling the cutter to be always aligned with a target cutting point on the outer side of the lower port of the chopper. The cutter and the chopper are fixed together to move up and down at the same time, and the vertical routing height is not affected due to the fact that the cutter and the chopper are fixed, so the length limitation of the vertical metal wire can be eliminated, and the vertical metal wire with the large length can be obtained; and meanwhile, the vertical metal wire cannot be bent additionally, so the metal wire can be prevented from deviating relative to the center of the bottom ball.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a vertical wire bonding device and a wire bonding method. Background technique [0002] In recent years, "faster, smaller, cheaper, and more reliable" has become the goal driving the development of the semiconductor technology field. In the field of semiconductor manufacturing, the density of integrated circuits is increased by continuously reducing the minimum feature size and increasing packaging stacks to meet the goal of "smaller". On this basis, "faster, cheaper, and more reliable" cannot be ignored. [0003] All computing and communication systems of integrated circuits need to be powered by the power transmission subsystem. The power transmission subsystem converts the high voltage of the power supply into different voltages required by each discrete device in the integrated circuit and transmits them. In stacked package chips, the connection Each layer of chips and...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a vertical wire bonding device and a wire bonding method, which are used to solve the problems of limited length of vertical metal wires and easy deviation in the prior art

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