Automatic board clamping device and locating clamping method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 深圳市易安锐自动化设备有限公司
- Publication Date
- 2021-04-16
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Abstract
Description
Technical field
[0001] The present invention relates to the field of PCB board processing, and more particularly to a positioning clamping method of an automatic splint device and an automatic splint device.Background technique
[0002] The PCB board is printed circuit board, also known as printed circuit board, printed circuit board, referred to as printed board, it is an important electronic component, which is a support of electronic components, and its processing quality and efficiency are critical. The existing automatic clamping substrate is mostly rising through the cylinder control clamp, directly topped mechanism, such a structure without any buffer, and easily damage the substrate in some cases, while the equipment work is easy to produce dust. There is an impact on the processing of the PCB board, affecting product quality;
[0003] In addition, the existing broader mechanism is adjusted by the structure of the lead wires through the linear slide rail. Although the structure can re...