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Reinforcement design method of electronic device, computer equipment and storage medium

A technology of electronic devices and design methods, applied in the field of reliability of electronic devices, can solve problems such as lack of reinforcement and optimization design methods

Pending Publication Date: 2021-04-16
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST THE FIFTH ELECTRONICS RES INST OF MIITCEPREI LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to address the problem that the current industry lacks an accurate and effective method of strengthening and optimizing design methods to reduce soft error rates, and provide a method of strengthening design of electronic devices, computer equipment and storage media

Method used

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  • Reinforcement design method of electronic device, computer equipment and storage medium
  • Reinforcement design method of electronic device, computer equipment and storage medium

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Embodiment Construction

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "left", "right", "upper", "lower", "front", "rear", "circumferential" and...

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PUM

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Abstract

The invention relates to the technical field of electronic device reliability, and discloses an electronic device reinforcement design method, computer equipment and a storage medium, and the method comprises the steps: obtaining a soft error rate index of an electronic device; according to the simulated irradiation test of the electronic device, obtaining the soft error rate of various single event upset types of the electronic device, and the single event upset types comprise unit upset and multi-bit upset; determining a to-be-reinforced type of the electronic device according to the sum of the soft error rates of all the single event upset types, the sum of the soft error rates of part of the single event upset types and the soft error rate index; and reinforcing and correcting the electronic device according to the to-be-reinforced type. The soft error rates of various single event upset types are obtained, the soft error rate index in the actual application environment is taken as the guidance, and a proper reinforcing mode is selected to reinforce and correct the electronic device, so that the electronic device is prevented from being excessively reinforced while reaching the soft error rate index. Therefore, resource consumption and performance reduction caused by reinforcement are reduced.

Description

technical field [0001] The invention relates to the technical field of reliability of electronic devices, in particular to a strengthening design method of electronic devices, computer equipment and storage media. Background technique [0002] Atmospheric neutrons and alpha particles are the main contributors to soft errors in semiconductor devices when used in Earth ground and aerospace environments. Alpha particles come from the packaging material of the device itself, and atmospheric neutrons come from the test environment. The soft errors caused by atmospheric neutrons and alpha particles are mainly single-event flips, including single-bit flips and multi-bit flips. Since these elements are very easy to appear in various materials of semiconductor devices, such as molding compounds, solder balls, fillers, etc., it is necessary to strengthen the design of semiconductor devices against single event upset, so that the soft error rate of semiconductor devices can meet the a...

Claims

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Application Information

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IPC IPC(8): G06Q10/06G06F11/10
Inventor 张战刚雷志锋黄云彭超何玉娟肖庆中路国光
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST THE FIFTH ELECTRONICS RES INST OF MIITCEPREI LAB