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Device for wafer bonding and de-bonding and wafer bonding and de-bonding method

A wafer bonding and debonding technology, applied to wafer bonding and debonding devices, in the field of wafer bonding and debonding, capable of solving problems such as wafer bonding and debonding

Active Publication Date: 2021-04-16
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a wafer bonding and debonding device and a wafer bonding and debonding method to solve the problem of how to bond and debond wafers

Method used

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  • Device for wafer bonding and de-bonding and wafer bonding and de-bonding method
  • Device for wafer bonding and de-bonding and wafer bonding and de-bonding method
  • Device for wafer bonding and de-bonding and wafer bonding and de-bonding method

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Embodiment Construction

[0054]In order to make the technical problems, technical solutions and advantages to solve the present invention more clearly, and will be described in detail below with reference to the accompanying drawings and specific examples. In the following description, providing specific details such as specific configurations and components are merely intended to help comprehensively understand the embodiments of the present invention. Thus, those skilled in the art will appreciate that various changes and modifications described herein without departing from the scope and spirit of the invention. Further, in order to clear and concise, a description of known functions and structures is omitted.

[0055]It will be understood that "one embodiment" or "one embodiment" mentioned in the specification means that specific features, structures, or characteristics related to the embodiments are included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment"...

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Abstract

The invention provides a device for wafer bonding and de-bonding and a wafer bonding and de-bonding method, and relates to the technical field of semiconductor packaging. The device comprises a platform, a workbench located on the platform, a moving structure, a vacuum adsorption structure, a glue dripping structure, a sucker structure, a driving structure and a lateral pushing structure; the workbench can move between a first position and a second position on the platform through the moving structure; the vacuum adsorption structure is used for adsorbing a to-be-bonded slide glass or a to-be-de-bonded wafer arranged on the workbench; the glue dripping structure is used for dripping bonding glue into the to-be-bonded slide glass; the sucker structure is used for adsorbing a to-be-bonded wafer; the driving structure is used for driving the workbench to rotate at the first position; and the lateral pushing structure is used for pushing the workbench to transversely move by a preset distance. The driving structure drives the workbench to rotate, the bonding glue is dripped in the rotating process, the bonding glue can be more uniform, the workbench is pushed to transversely move through the lateral pushing structure, the contact area between the wafer and the slide glass on the workbench is reduced, de-bonding is easier, and the fragment probability in the de-bonding process is reduced.

Description

Technical field[0001]The present invention relates to the field of semiconductor package, and more particularly to a device for a wafer bonding and a bonding method and a wafer bonding and solution bonding method.Background technique[0002]As semiconductor new products are increasingly required for various components integration and function, traditional two-dimensional integrated circuits have been difficult to meet demand, and 3D-TSV packaging technology came into being. 3D-TSV packaging techniques need to multilayer laminate bonding, and must also meet the total package thickness, so the wafer thickness needs to be reduced to 30-100 um. Since the wafer is thinned to 150 um, it will become flexible and easier to deform or warp, and the subsequent process operation is not easy to perform, and the wafer is temporarily bonded to the slide, and the subsequent process is perfect. The wafer is separated from the slide.Inventive content[0003]Embodiments of the present invention provide a ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCY02P70/50
Inventor 袁晓春张振敏周丹
Owner CETC BEIJING ELECTRONICS EQUIP
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