Device for wafer bonding and de-bonding and wafer bonding and de-bonding method
A wafer bonding and debonding technology, applied to wafer bonding and debonding devices, in the field of wafer bonding and debonding, capable of solving problems such as wafer bonding and debonding
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[0054]In order to make the technical problems, technical solutions and advantages to solve the present invention more clearly, and will be described in detail below with reference to the accompanying drawings and specific examples. In the following description, providing specific details such as specific configurations and components are merely intended to help comprehensively understand the embodiments of the present invention. Thus, those skilled in the art will appreciate that various changes and modifications described herein without departing from the scope and spirit of the invention. Further, in order to clear and concise, a description of known functions and structures is omitted.
[0055]It will be understood that "one embodiment" or "one embodiment" mentioned in the specification means that specific features, structures, or characteristics related to the embodiments are included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment"...
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