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Sub-miniature microphone

A technology of microphone and transducer, applied in the field of microphone components

Active Publication Date: 2021-04-20
KNOWLES ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In microphone assemblies including MEMS acoustic transducers, the SNR typically limits the minimum achievable size and overall package size of the microphone assembly

Method used

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  • Sub-miniature microphone
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Examples

Experimental program
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Embodiment Construction

[0033] Pressure microphones typically include a diaphragm that responds to a pressure differential on either side of it. In omnidirectional microphone 10, see figure 1 , one side of the diaphragm 12 is coupled to the external environment 14, and the pressure on this side of the diaphragm 12 is atmospheric pressure (P atm ) and the desired acoustic signal (P ac )Sum. The pressure on the other side of the diaphragm 12 is provided by a back cavity volume 16 which is acoustically isolated from the external environment 14 but still maintains atmospheric pressure in the back cavity volume through a small acoustic leak 15 .

[0034] figure 2 show figure 1 A small-signal lumped-element model of the omnidirectional microphone 10 . The compliance of diaphragm 12 and rear cavity volume 16 is determined by C D and C BV express. The resistance of acoustic leakage 15 is determined by R Leak express. The pressure P on the diaphragm 12 D The diaphragm 12 is moved. Note that the a...

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Abstract

Disclosed is a sub-miniature microphone. A MEMS transducer includes a transducer substrate, a counter electrode, and a diaphragm. The counter electrode is coupled to the transducer substrate. The diaphragm is oriented substantially parallel to the counter electrode and is spaced apart from the counter electrode to form a gap. A back volume of the MEMS transducer is an enclosed volume positioned between the counter electrode and the diaphragm. A height of the gap between the counter electrode and the diaphragm is less than two times the thermal boundary layer thickness within the back volume at an upper limit of the audio frequency band of the MEMS transducer.

Description

technical field [0001] The present disclosure relates to microphone assemblies including microelectromechanical systems (MEMS). Background technique [0002] A microphone assembly comprising a microelectromechanical system (MEMS) acoustic transducer converts acoustic energy into an electrical signal. Microphone assemblies may be used in mobile communication devices, laptop computers and appliances, among other devices and machines. An important parameter of a microphone assembly is the acoustic signal-to-noise ratio (SNR), which compares the desired signal level (eg, signal amplitude due to acoustic disturbances captured by the microphone assembly) to the background noise level. In microphone assemblies including MEMS acoustic transducers, the SNR typically limits the minimum achievable size and overall package size of the microphone assembly. Contents of the invention [0003] A first aspect of the disclosure relates to a MEMS transducer. The MEMS transducer includes a...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R19/00
CPCH04R2201/003H04R19/005H04R19/04H04R1/02
Inventor V·纳德瑞恩M·佩德森彼得·洛佩特
Owner KNOWLES ELECTRONICS INC