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High-frequency low-loss multilayer FPC and production process thereof

A production process, low-loss technology, applied in multilayer circuit manufacturing, circuit substrate materials, printed circuit components, etc., can solve the problems of very high pressing technical requirements and low success rate, and achieve excellent high-frequency low-loss performance, The effect of low insertion loss performance

Pending Publication Date: 2021-04-20
ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the multi-layer FPC without adhesive layer LCP needs high-temperature pressing during production, requires special equipment, and has very high requirements for pressing technology, and the success rate is low.

Method used

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  • High-frequency low-loss multilayer FPC and production process thereof
  • High-frequency low-loss multilayer FPC and production process thereof
  • High-frequency low-loss multilayer FPC and production process thereof

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Embodiment Construction

[0044] like Figure 1 to Figure 15 As shown, the high-frequency low-loss multilayer FPC includes a first LCP base material, copper foil is compounded on the upper and lower sides of the first LCP base material, and copper foil on the first LCP base material is compounded with A high-frequency adhesive film, the high-frequency adhesive film is compounded with a second LCP substrate, the second LCP substrate is compounded with copper foil, and the copper foil on the first LCP substrate is provided with an inner layer circuit , the copper foil below the first LCP substrate is provided with a lower circuit, the copper foil above the second LCP substrate is provided with an upper circuit, the upper circuit, the inner circuit, and the lower circuit mutual conduction.

[0045] The high-frequency adhesive film is modified epoxy adhesive or fluorine-containing adhesive or ether-containing adhesive or modified rubber or hydrocarbon resin.

[0046] like figure 1 As shown, the laminate...

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Abstract

The invention discloses and provides a high-frequency low-loss multilayer FPC (flexible printed circuit) and a production process thereof, which can meet the requirement of high-frequency signal transmission performance, have higher high-frequency low-loss performance than a conventional PI (polyimide) FPC, and are simple and easy to produce. The high-frequency low-loss multilayer FPC comprises a first LCP base material, copper foils are compounded on the upper surface and the lower surface of the first LCP base material, a high-frequency adhesive film is compounded on the copper foil on the first LCP base material, a second LCP base material is compounded on the high-frequency adhesive film, a copper foil is compounded on the second LCP base material, and an inner layer circuit is arranged on the copper foil on the first LCP base material. The copper foil below the first LCP base material is provided with a lower layer circuit, the copper foil above the second LCP base material is provided with an upper layer circuit, and the upper layer circuit, the inner layer circuit and the lower layer circuit are mutually conducted; the production process of the high-frequency low-loss multilayer FPC adopts a process that the inner high-frequency adhesive film layer of the LCP layer of the outer copper-clad plate is attached to the inner circuit. The process can be applied to the technical field of FPC production.

Description

technical field [0001] The invention relates to an FPC and a production process thereof, in particular to a high-frequency low-loss multilayer FPC and a production process thereof. Background technique [0002] With the development of mobile communication and the increase of signal frequency, the dielectric loss of FPC for signal transmission is also required to be reduced, so as to avoid excessive signal loss and affect the quality. In this case, traditional FPC can no longer meet the low loss requirements. Due to its special physical properties and low high-frequency signal loss, LCP can be used to make FPC to obtain good signal loss performance. However, multi-layer FPC without adhesive layer LCP needs high-temperature pressing during production, requires special equipment, and has very high requirements for pressing technology, and the success rate is low. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05H05K3/46
Inventor 胡可林均秀刘志勇
Owner ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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