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Golden finger circuit board processing method and golden finger circuit board

A processing method and technology of gold fingers, applied in printed circuits, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve problems such as failure, collision or scratching of gold fingers, affecting processing of gold fingers, etc., so as to improve processing quality and prolong service life. Longevity, Possibility Reduction Effect

Active Publication Date: 2021-04-30
HUAIAN TECHUANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the gold finger is directly exposed to the outside, during processing, the processing equipment or human hands are likely to directly touch the contact piece of the gold finger, resulting in damage to the surface of the gold finger contact piece, which in turn affects the processing of the gold finger
In addition, in daily use, the contact sheet is easy to collide or scratch with external objects, causing the contact sheet of the gold finger to be easily damaged, which in turn affects the information transmission efficiency and even causes the gold finger to fail. Therefore, the traditional multi-layer circuit board gold finger Processing methods Traditional circuit board gold fingers often have a short service life

Method used

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  • Golden finger circuit board processing method and golden finger circuit board
  • Golden finger circuit board processing method and golden finger circuit board
  • Golden finger circuit board processing method and golden finger circuit board

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0037] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention provides a golden finger circuit board processing method and a golden finger circuit board. The golden finger circuit board processing method comprises the following steps: manufacturing a golden finger on a first substrate, and windowing on a curing sheet according to the position of the golden finger; stacking the first substrate, the curing sheet and the second substrate in sequence; laminating the first substrate, the curing sheet and the second substrate to fixedly connect the first substrate, the curing sheet and the second substrate; and performing multiple depth control milling on the second substrate according to the position of the golden finger so as to form a plurality of communication grooves penetrating through the second substrate on the second substrate. The second substrate is subjected to multiple times of depth control milling, so that the multiple strip-shaped metal strip bodies are exposed in the multiple communicating grooves in a one-to-one correspondence mode, and when external equipment or a human hand is about to make contact with a golden finger, notches of the communicated grooves can be blocked, that is, the situation that the information transmission efficiency is affected due to the fact that the surface of the golden finger is damaged in the machining process can be prevented.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a gold finger circuit board processing method and a gold finger circuit board. Background technique [0002] Gold finger refers to pads arranged like fingers that are used to insert into the card slot and make contact with the metal spring in the slot. Because this type of design has high requirements on the wear resistance and conductivity of the pad surface, it is A layer of nickel and a layer of gold will be plated on the surface of the pad, so it is commonly called a gold finger. [0003] The traditional processing method of gold fingers of multi-layer circuit boards is to make gold finger contact sheets on the surface of the inner layer board, then stack the inner layer board, cured sheet and outer layer board, and press them into a whole in a pressing machine, and finally put them on the outer layer board. The laminate is slotted so that the golden fingers of the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/18H05K3/40H05K3/46H05K1/02H05K1/11
CPCH05K3/00H05K3/188H05K3/403H05K3/46H05K1/117H05K1/0271H05K1/02
Inventor 许校彬
Owner HUAIAN TECHUANG TECH CO LTD
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