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A piezoelectric mems sensor and related equipment

A piezoelectric and sensor technology, applied in the field of sound and electricity, which can solve the problems of low signal-to-noise ratio and low sensitivity

Active Publication Date: 2022-03-25
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a piezoelectric MEMS sensor and related equipment, which can solve the problems of low signal-to-noise ratio and low sensitivity existing in the existing piezoelectric MEMS sensor

Method used

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  • A piezoelectric mems sensor and related equipment
  • A piezoelectric mems sensor and related equipment
  • A piezoelectric mems sensor and related equipment

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Embodiment Construction

[0055] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0056] The following first combines image 3 The structure of the audio system provided by this embodiment is shown as an example:

[0057] The audio system 300 shown in this embodiment can be applied to a terminal device, and the terminal device can be a cellular phone, a cordless phone, a session initiation protocol (session initiation protocol, SIP) phone, a personal digital assistant (PDA), a wireless communication Functional handheld devices, computing devices, vehicle-m...

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Abstract

The embodiment of the present invention discloses a piezoelectric MEMS sensor and related equipment, which are applied in scenarios such as terminals, smart speakers, wireless Bluetooth headsets, active noise reduction headsets, notebooks, and the automobile industry. The piezoelectric MEMS sensor includes a The base of the channel and at least one cantilever beam, the cantilever beam includes a first area and a second area connected to each other; the first area includes a first side and a second side, the first side is the side of the first area facing the target surface, and the target The surface is the surface where the cantilever beam is connected to the base. The included angle between the first side and the second side is greater than or equal to 90 degrees and less than 180 degrees, so that the restrictions on both sides of the area of ​​the cantilever beam close to the base are reduced, and the two sides of the cantilever beam will not be affected by other structures. Constraints, thus effectively ensuring the free deformation of the cantilever beam, is conducive to improving the uniform stress distribution of the cantilever beam, and effectively improving the signal-to-noise ratio and sensitivity.

Description

technical field [0001] The present application relates to the field of acoustic-electric technology, in particular to a piezoelectric MEMS sensor and related equipment. Background technique [0002] Piezoelectric micro-electromechanical systems (MEMS) sensors are more and more widely used because of their relatively good dustproof and waterproof advantages. [0003] see below figure 1 As shown, the structure of the existing piezoelectric MEMS sensor is described, such as figure 1 As shown, the piezoelectric MEMS sensor is composed of multiple diaphragms 101, one end of each diaphragm 101 is connected to the substrate 102, and the other end adopts a cantilever beam structure. Such as figure 2 As shown, after the cantilever beam structure 201 is pressed by the sound pressure, it will bend upwards to form a stress difference between the upper surface and the lower surface of the cantilever beam 201, thereby generating a voltage. [0004] However, due to the uneven distribu...

Claims

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Application Information

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IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003H04R17/02H04R31/006B81B7/02H04R17/005H10N30/302H10N30/306
Inventor 姚丹阳徐景辉
Owner HUAWEI TECH CO LTD
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