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Manufacturing method of rigid-flexible board with inner-layer slotted hole

A soft-rigid combination board and production method technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of increasing labor costs, scrapping, time-consuming, etc., to improve production efficiency, convenient operation, and process flow easy effect

Active Publication Date: 2021-05-04
龙南骏亚柔性智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current rigid-flex board adopts the production process of anti-adhesive film + prepreg + cover when it encounters the design of slots and flat pads in the inner layer. This method makes both slots and flat pads It is necessary to open the cover, which is very time-consuming and increases labor costs. Moreover, due to the uneven depth of the laser, the soft board cover film or copper layer at the opening will be cut by the laser, resulting in scrapping. For this reason, a A kind of manufacturing method of rigid-flex board with inner layer slots to solve the above problems

Method used

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  • Manufacturing method of rigid-flexible board with inner-layer slotted hole
  • Manufacturing method of rigid-flexible board with inner-layer slotted hole
  • Manufacturing method of rigid-flexible board with inner-layer slotted hole

Examples

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Effect test

Embodiment 1

[0028]Example 1: Please refer toFigure 1 - Figure 3The present invention discloses a method of fabricating the inner layer slot soft bonding plate, including the following steps:

[0029]S1 soft plate substrate opening: first prepared flexible circuit board 1 inwardly laminated, a planar pad 2 and a slot 3 are provided on the flexible circuit board 1, according to the line design requirements, the inner layer of the flexible circuit board 1. Layer printed resistance ink 5, the etching ink 5 covers the position of the planar pad 2, and then places the ink up, stand, and the flexible circuit board 1 is placed horizontally under the bonding planar pad 2. The etching ink 5 is dried, and the inner layer line is formed by etching machine, the flexible circuit board 1 includes a soft plate substrate having a soft plate copper layer on the surface, and the inner layer line and inner layer of the soft plate copper layer. The baking condition is 70 ° C for 25 min, the planar pad 2 edge is more t...

Embodiment 2

[0036]Example 2: Please refer toFigure 1 - Figure 3The present invention discloses a method of fabricating the inner layer slot soft bonding plate, including the following steps:

[0037]S1 soft plate substrate opening: first prepared flexible circuit board 1 inwardly laminated, a planar pad 2 and a slot 3 are provided on the flexible circuit board 1, according to the line design requirements, the inner layer of the flexible circuit board 1. Layer printed resistance ink 5, the etching ink 5 covers the position of the planar pad 2, and then places the ink up, stand, and the flexible circuit board 1 is placed horizontally under the bonding planar pad 2. The etching ink 5 is dried, and the inner layer line is formed by etching machine, the flexible circuit board 1 includes a soft plate substrate having a soft plate copper layer on the surface, and the inner layer line and inner layer of the soft plate copper layer. The baking condition is 75 ° C for 30 min, the planar pad 2 edge is more t...

Embodiment 3

[0044]Example 3: Please refer toFigure 1 - Figure 3The present invention discloses a method of fabricating the inner layer slot soft bonding plate, including the following steps:

[0045]S1 soft plate substrate opening: first prepared flexible circuit board 1 inwardly laminated, a planar pad 2 and a slot 3 are provided on the flexible circuit board 1, according to the line design requirements, the inner layer of the flexible circuit board 1. Layer printed resistance ink 5, the etching ink 5 covers the position of the planar pad 2, and then places the ink up, stand, and the flexible circuit board 1 is placed horizontally under the bonding planar pad 2. The etching ink 5 is dried, and the inner layer line is formed by etching machine, the flexible circuit board 1 includes a soft plate substrate having a soft plate copper layer on the surface, and the inner layer line and inner layer of the soft plate copper layer. The baking condition is 80 ° C for 35min, and the edge pad 2 edge is more ...

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Abstract

The invention discloses a manufacturing method of a rigid-flexible board with an inner-layer slotted hole, belonging to the technical field of electronic circuit boards. The method comprises the following step: S1, rough shape cutting of a base material of a flexible board: preparing a flexible circuit board which is laminated from inside to outside and is provided with a planar bonding pad and a slotted hole at first, printing anti-etching ink on an inner copper layer of the flexible circuit board according to a circuit design requirement, covering the position of the planar bonding pad with the anti-etching ink, enabling the ink to face upwards, conducting standing, horizontally placing the flexible circuit board in a manner that the bonding pad faces downwards, baking the flexible circuit board to totally dry the anti-etching ink, and forming an inner-layer circuit through etching of an etching machine. The manufacturing method is simple and convenient in process and convenient to operate, does not increase other cost input, can be realized under the condition of not changing existing process parameters and production equipment, is suitable for all the rigid-flexible boards with inner-layer slotted holes, reduces uncovering times, and improves production efficiency.

Description

Technical field[0001]The present invention relates to the technical field of electronic circuit board, and is specifically a method of fabricating a soft bonding plate having an inner layer.Background technique[0002]The birth and development of the flexible circuit board and the hard board has spawned the new product of the soft bonding plate. Therefore, the soft and hard bonding plate is the flexible circuit board and the hard circuit board. After pressing, it is combined according to the relevant process. Together, the formed circuit board with FPC characteristics and PCB characteristics: The hard bonding plate is at the same time with the characteristics of the flexible circuit board and the hard circuit board. Therefore, it can be used in some special requirements, both certain The flexible area, there is also a certain rigid area, which has great help to save product internal space, reduce the volume of finished product, and improve product performance. With the rapid developme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4691H05K3/4611H05K2203/061
Inventor 岳林文彪李彬李泽勤黄瑞左益明
Owner 龙南骏亚柔性智能科技有限公司