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Semiconductor vacuum equipment

A vacuum equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low output rate of vacuum equipment, low production capacity of semiconductor equipment, and affecting production capacity of semiconductor processing equipment

Inactive Publication Date: 2021-05-07
上海广川科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the low output rate of vacuum equipment, the processing time of semiconductors is longer, which seriously affects the production capacity of semiconductor processing equipment, resulting in low production capacity of semiconductor equipment

Method used

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  • Semiconductor vacuum equipment
  • Semiconductor vacuum equipment
  • Semiconductor vacuum equipment

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Embodiment Construction

[0032] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0033] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.

[0034] In the following specific embodiments of the present invention, please r...

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Abstract

The invention provides semiconductor vacuum equipment. The equipment comprises a first cavity, one side of the first cavity is provided with a first opening, the other side of the first cavity is provided with a second opening opposite to the first opening, a wafer supporting unit is arranged in the first cavity, and the bottom of the first cavity is provided with a first through hole and a second through hole. The top of the first cavity is provided with an opening, an annular groove surrounding the opening, a sealing ring filling the annular groove and a top cover covering the opening. According to the semiconductor vacuum equipment provided by the invention, the annular groove with an exhaust hole is formed in the top of the first cavity, so that the speed of extracting the first cavity from the atmospheric state to the vacuum state is ensured, and the utilization rate of the equipment is improved.

Description

technical field [0001] The present invention relates to the field of semiconductor equipment, more specifically, to a semiconductor vacuum equipment. Background technique [0002] At present, in the semiconductor manufacturing industry, the vacuum reaction equipment used all includes a vacuum transition chamber, a transfer chamber and at least one reaction chamber, wherein the transfer chamber is connected to the vacuum transition chamber and each reaction chamber respectively. A manipulator is provided in the transfer chamber, and the manipulator can realize the turnover of plate products such as substrates between the vacuum transition chamber and each reaction chamber. [0003] However, the process time of the vacuum process is longer, which is mainly reflected in the pumping time and inflation time, such as figure 1 as shown, figure 1 It is a structural schematic diagram of a loading unit of a semiconductor vacuum equipment in the prior art. The loading unit is provide...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/6719H01L21/67207
Inventor 高飞翔董怀宝李世敏
Owner 上海广川科技有限公司