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Lead frame, plastic packaging mold and packaging structure

A technology for plastic sealing molds and lead frames, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., and can solve the problems of low lead frame unit arrangement rate, high cost, and low cutting and separation efficiency

Pending Publication Date: 2021-05-18
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the unit price of the corroded lead frame is high, and the back of each lead frame needs to be filmed, the cost of the film is high, and the cutting and separation efficiency is low; the arrangement rate of the lead frame units in the stamped lead frame is low, and the cutting process needs to be equipped with corresponding molds and tool holder

Method used

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  • Lead frame, plastic packaging mold and packaging structure
  • Lead frame, plastic packaging mold and packaging structure
  • Lead frame, plastic packaging mold and packaging structure

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0023] The terminology used in the present invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein and in the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0024] Some embodiments of the present invention will be described in detail below with referenc...

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PUM

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Abstract

The invention discloses a novel lead frame, a plastic packaging mold and a packaging structure, the lead frame comprises a lead frame body and a plurality of lead frame units connected in the lead frame body, the plurality of lead frame units are arranged in an array, the plurality of lead frame units in each column are sequentially connected and arranged through pins, and the plurality of lead frame units in each column are sequentially connected and arranged through the pins. The lead frame units in each column are connected with one another through connecting ribs. The invention designs a novel lead frame, a plastic packaging mold and a packaging structure, through the structural design of the lead frame, the cost of the lead frame is reduced, the cutting and separating efficiency is improved, and a mold and a tool corresponding to cutting can be shared, so that the packaging cost can be reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor plastic packaging, in particular to a lead frame, a plastic packaging mold and a packaging structure. Background technique [0002] In the semiconductor manufacturing process, the semiconductor structure is usually integrated into the lead frame, and the lead frame is used as the chip carrier of the integrated circuit to form an electrical circuit and act as a bridge connecting the external wires. [0003] For the subsequent formation of a single chip product, the prior art generally adopts a method of etching the lead frame or stamping and cutting the lead frame. However, the unit price of the corroded lead frame is high, and the back of each lead frame needs to be filmed, the cost of the film is high, and the cutting and separation efficiency is low; the arrangement rate of the lead frame units in the stamped lead frame is low, and the cutting process needs to be equipped with correspondin...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/56H01L23/04
CPCH01L23/49541H01L21/565H01L23/04H01L2224/97
Inventor 阙燕洁
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH