Input impedance matching network and radio frequency front-end module

A technology of matching network and input impedance, applied in the field of radio frequency communication, can solve problems such as impedance matching

Active Publication Date: 2021-05-18
RADROCK (SHENZHEN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides an input impedance matching network and a radio frequency front-end module to solve the problem of impedance matching caused by the parasitic capacitance introduced by the pad in the actual circuit

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  • Input impedance matching network and radio frequency front-end module
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  • Input impedance matching network and radio frequency front-end module

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and like reference numer...

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PUM

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Abstract

The invention discloses an input impedance matching network and a radio frequency front-end module. The input impedance matching network comprises a first bonding pad, a second bonding pad and a first inductor, one end of the first inductor is connected with the first bonding pad, the other end of the first inductor is connected with the second bonding pad, and the output end of the second bonding pad serves as the output end of the input impedance matching network and is configured to be connected with the input end of a low-noise amplifier; the input impedance matching network further comprises a compensation adjustment circuit connected with the first bonding pad and / or the second bonding pad, and the compensation adjustment circuit is configured to adjust the parasitic capacitance from the first bonding pad to the ground and / or the parasitic capacitance from the second bonding pad to the ground, so that the parasitic capacitance from the first bonding pad to the ground is larger than the parasitic capacitance from the second bonding pad to the ground. The compensation adjustment circuit can enable the parasitic capacitance from the first bonding pad to the ground to be larger than the parasitic capacitance from the second bonding pad to the ground, the problem of impedance mismatch caused by equal parasitic capacitance is solved, and impedance matching of the input end of the low-noise amplifier is achieved.

Description

technical field [0001] The invention relates to the technical field of radio frequency communication, in particular to an input impedance matching network and a radio frequency front-end module. Background technique [0002] As the first stage of the receiver, the performance of the low-noise amplifier plays a crucial role in the performance of the whole receiver system, because the signal-to-noise ratio (SNR) of the whole receiver system largely depends on the performance of the low-noise amplifier. Noise figure (NF) and gain, therefore, designing a low-noise amplifier with good performance becomes an important goal of RF front-end design. According to the noise cascading formula, it can be seen that the input impedance matching network of the low noise amplifier has a great influence on the noise figure of the low noise amplifier, and also affects the gain of the low noise amplifier. Generally, the input matching of a low-noise amplifier is realized by a series inductor. ...

Claims

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Application Information

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IPC IPC(8): H04B1/18H04L25/02
CPCH04B1/18H04L25/0278
Inventor 丁团结倪建兴
Owner RADROCK (SHENZHEN) TECH CO LTD
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