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Flexible circuit board and flexible chip packaging structure

A technology of chip packaging structure and flexible circuit board, which is applied to printed circuits, printed circuit parts, printed circuits connected with non-printed electrical components, etc., can solve the problem of limited flexibility, affecting the flexibility of flexible chips, and difficult large-angle bending And other issues

Pending Publication Date: 2021-05-25
浙江荷清柔性电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventors found that after the flexible chip is mounted on the flexible circuit board, the flexible chip packaging structure formed has the problem of relatively limited flexibility, and it is difficult to realize large-angle bending, which affects the flexibility of the flexible chip and affects the use of flexible electronic products performance

Method used

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  • Flexible circuit board and flexible chip packaging structure
  • Flexible circuit board and flexible chip packaging structure
  • Flexible circuit board and flexible chip packaging structure

Examples

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Effect test

example 1

[0051] Prepare flexible circuit board A. Structural reference for flexible circuit board A Figure 5 , the second peripheral region of the flexible circuit board A includes a flexible film substrate, conductive sublayers respectively arranged on opposite sides of the flexible film substrate, and flexible flexible substrates respectively arranged on the side of the two conductive sublayers away from the flexible film substrate. The film sublayer, wherein the flexible film substrate is a flexible circuit board copper clad (FCCL) substrate, the thickness of the flexible film substrate is 86 μm, and the conductive sublayer is a copper layer electroplated on the surface of the flexible film substrate, which is conductive The thickness of the sublayer is 20 μm, the flexible film sublayer is a polyimide protective layer, and the side of the polyimide protective layer facing the flexible film sublayer has an adhesive layer, and the thickness of the polyimide protective layer is 12.5 μ...

example 2

[0053] Prepare flexible circuit board B. Structural reference for flex circuit board B Figure 6 , the second peripheral area of ​​the flexible circuit board B includes a flexible film substrate, conductive sublayers respectively arranged on opposite sides of the flexible film substrate, and flexible flexible substrates respectively arranged on the side of the two conductive sublayers away from the flexible film substrate. The film sublayer, wherein the flexible film substrate is a flexible circuit board copper clad (FCCL) substrate, the thickness of the flexible film substrate is 86 μm, and the conductive sublayer is a copper layer electroplated on the surface of the flexible film substrate, which is conductive The thickness of the sublayer is 20 μm, the flexible film sublayer is a polyimide protective layer, and the side of the polyimide protective layer facing the flexible film sublayer has an adhesive layer, and the thickness of the polyimide protective layer is 12.5 μm ,...

example 3

[0055] Prepare the flexible circuit board C. Structural reference for flexible circuit board C Figure 7 , the second peripheral area of ​​the flexible circuit board C includes a flexible film substrate, conductive sublayers respectively arranged on opposite sides of the flexible film substrate, and flexible flexible substrates respectively arranged on the side of the two conductive sublayers away from the flexible film substrate. The film sublayer, wherein the flexible film substrate is a flexible circuit board copper clad (FCCL) substrate, the thickness of the flexible film substrate is 86 μm, and the conductive sublayer is a copper layer electroplated on the surface of the flexible film substrate, which is conductive The thickness of the sublayer is 20 μm, the flexible film sublayer is a polyimide protective layer, and the side of the polyimide protective layer facing the flexible film sublayer has an adhesive layer, and the thickness of the polyimide protective layer is 12...

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Abstract

The invention discloses a flexible circuit board and a flexible chip packaging structure. Specifically, the invention discloses a flexible circuit board, and the flexible circuit board comprises a chip region which is used for the arrangement of a flexible chip; a first peripheral region which is arranged around the chip region; a second peripheral region, which comprises an area, except for the chip area and the first peripheral area, on the flexible circuit board, wherein the thickness of at least one of the chip area and the first peripheral area is smaller than that of the second peripheral area. Therefore, at least one of the chip area used for arranging the flexible chip on the flexible circuit board and the first peripheral area around the chip area is thinned, and after the flexible chip is packaged on the flexible circuit board, the formed flexible chip packaging structure has good flexibility and better use performance.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a flexible circuit board and a flexible chip packaging structure. Background technique [0002] At present, with the improvement of technology and people's living standards, the flexibility, wearable and foldable electronic products have become new development requirements, and flexible electronic products are widely used in electronic communication, medical and military fields. Traditional flexible electronic devices use surface mount technology to mount traditional hard-encapsulated chips on flexible circuit boards. The circuit board in the area of ​​hard-encapsulated chips is still rigid after surface mounting. Therefore, the advantages of flexible circuit boards are often It cannot be fully reflected and cannot meet the flexible needs of flexible products. At present, with the rapid development of the semiconductor industry, the birth of flexible chips has better solved this p...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/02H05K1/0298H05K1/189
Inventor 陈闯喻源李炳辉王波缪炳有宋冬生魏瑀刘东亮腾乙超姚建黄勤兵
Owner 浙江荷清柔性电子技术有限公司
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