Mosaic joint structure and mobile carrier

A joint structure and vehicle technology, which is applied in the connection and connection between the superstructure and the superstructure sub-assemblies, can solve the problems of poor vibration isolation effect and noise, reduce the center of gravity of the whole vehicle, reduce the difficulty, The effect of improving stability

Active Publication Date: 2021-05-28
METAL INDS RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the chassis frame 92 and the upper body 91 of the motor vehicle 9 of said patent document adopt traditional bolts to fix the chassis frame 92 and the upper body 91 together, and above the front joint (front shock tower) Set rubber damping, no setting for rear joint
Long-term use of motor vehicles9 is likely to generate noise, and the vibration isolation effect is poor

Method used

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  • Mosaic joint structure and mobile carrier
  • Mosaic joint structure and mobile carrier
  • Mosaic joint structure and mobile carrier

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Embodiment Construction

[0054] In order to make the above objects, features and features of the present invention more comprehensible, the relevant embodiments of the present invention are described in detail as follows with reference to the accompanying drawings.

[0055] figure 2 It is an exploded perspective view of an upper joint and a lower joint of a mosaic joint structure according to an embodiment of the present invention. Please refer to figure 2 , the mosaic joint structure 1 includes an upper joint 11 and a lower joint 12 . The upper connector 11 includes an upper connector socket 111 , an upper connector elastic material seat 112 , an upper connector fixing member 113 , an upper carrier base 114 , an upper connector magnet 115 and an annular upper plate 116 . The upper joint elastic material seat 112 overlaps the upper joint socket 111 , the annular upper plate 116 overlaps the upper carrier bottom plate 114 , and the annular upper plate 116 surrounds and adheres to the upper joint el...

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Abstract

The invention discloses a mosaic joint structure which comprises an upper joint and a lower joint used for being connected to the upper joint, wherein the opposite faces of an upper joint elastic material seat and a lower joint elastic material seat abut against each other, an upper joint magnet and a lower joint magnet are mounted on the opposite surfaces of the upper joint elastic material seat and the lower joint elastic material seat, and an upper connector socket is connected with a lower connector socket. A shock insulation assembly is arranged between a shock insulation seat top cover and a rigid material seat annular bottom box, the shock insulation seat bottom box is fixed to a lower carrier bottom plate, and the shock insulation seat top cover abuts against an upper carrier bottom plate. The relative position relation of the upper carrier bottom plate and the lower carrier bottom plate is restrained through the fixing mode of an upper connector fixing piece and a lower connector fixing piece. The mosaic joint structure is provided with a structure capable of quickly connecting the electrical and entity line signals between an upper vehicle body and a lower vehicle body and damping.

Description

technical field [0001] The present invention relates to an inlaid joint structure and a mobile carrier, and in particular to an inlaid joint structure for quickly connecting the lower body and the upper body of the mobile carrier. Background technique [0002] At present, the modular detachable vehicle (Rinspeed SNAP) adopts a skateboard chassis structure, which is designed based on the body on frame structure. The chassis can carry the upper body with different application functions, and carry out Shared and shared mobile applications, which use the tenon structure to connect the upper body. However, the fast connection of electrical signals and physical lines is a problem. The solution is to install an independent control computer and power supply on the modular upper body, so that the upper and lower bodies can be combined without signal connection. However, this move will inevitably increase the weight and cost of the upper body because it reduces the components shared ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B62D27/06B60R16/02H01R13/62
CPCB62D27/06B60R16/02H01R13/6205
Inventor 林祐廷陈泰昌江进丰蔡佳浓
Owner METAL INDS RES & DEV CENT
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