High-temperature-resistant easy-to-process thermoplastic transparent polyimide resin material with low thermal expansion coefficient and preparation method thereof

A technology of polyimide resin and low thermal expansion coefficient, which is applied in the field of thermoplastic transparent polyimide materials and its preparation, and can solve the problems of pure resin that does not have repeated processing, cannot be normally extruded and injected, and has low thermal expansion coefficient , to achieve excellent compatibility, lower processing temperature, and higher melt index

Pending Publication Date: 2021-05-28
宁波惠璞新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its high glass transition temperature, the pure resin does not have the ability to be processed repeatedly, and cross-linking and carbonization are prone to occur during processing, resulting in blackening of the resin and even failure of normal extr

Method used

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  • High-temperature-resistant easy-to-process thermoplastic transparent polyimide resin material with low thermal expansion coefficient and preparation method thereof
  • High-temperature-resistant easy-to-process thermoplastic transparent polyimide resin material with low thermal expansion coefficient and preparation method thereof
  • High-temperature-resistant easy-to-process thermoplastic transparent polyimide resin material with low thermal expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] A high-temperature-resistant and easy-to-process thermoplastic transparent polyimide resin material with a low coefficient of thermal expansion has the following composition content:

[0056] (1) High temperature resistant thermoplastic transparent polyimide resin with a glass transition temperature greater than 240°C and a thermal expansion coefficient less than 45ppm / K: the content is 98%;

[0057] Its structural formula is as follows:

[0058]

[0059] It is prepared according to the preparation method disclosed in Example 1 of the patent CN 111057236 A (application number 201911214345.6).

[0060] Its inherent viscosity is 0.68dL / g, glass transition temperature is 295°C, and thermal expansion coefficient is 23ppm / K. .

[0061] (2) Antioxidant 1010: 0.5%;

[0062] (3) Lubricant PETS: 0.5%;

[0063] (4) Low molecular weight polyimide resin: 1%.

[0064] Its structural formula is as follows:

[0065]

[0066] Its inherent viscosity is: 0.21dL / g. The prepar...

Embodiment 2

[0074] A high-temperature-resistant and easy-to-process thermoplastic transparent polyimide resin material with a low coefficient of thermal expansion has the following composition content:

[0075] (1) High temperature resistant thermoplastic transparent polyimide resin with a glass transition temperature greater than 240°C and a thermal expansion coefficient less than 45ppm / K: the content is 99%;

[0076] Its structural formula is as follows:

[0077]

[0078] Its inherent viscosity is: 0.60dL / g.

[0079] (2) Antioxidant 1010: 0.3%;

[0080] (3) Lubricant PETS: 0.3%;

[0081] (4) Low molecular weight polyimide resin: 0.4%.

[0082] Its structural formula is as follows:

[0083]

[0084] The preparation method is the same as component (1), but the molecular weight is controlled, and the logarithmic viscosity is: 0.21dL / g.

[0085] The extrusion temperature of the WELLZOON brand C-type high-temperature desktop extruder is 330°C, and the extruded resin pellets are re...

Embodiment 3

[0087] A high-temperature-resistant and easy-to-process thermoplastic transparent polyimide resin material with a low coefficient of thermal expansion has the following composition content:

[0088] (1) High temperature resistant thermoplastic transparent polyimide resin with a glass transition temperature greater than 240°C and a thermal expansion coefficient less than 45ppm / K: the content is 95.5%;

[0089] Its structural formula is as follows:

[0090]

[0091] It is prepared according to the preparation method disclosed in Example 4 of the patent CN 111057236 A (application number 201911214345.6).

[0092] Its inherent viscosity is: 0.45dL / g.

[0093] (2) Antioxidant 168: 1.5%;

[0094] (3) Lubricant paraffin: 2.5%;

[0095] (4) Low molecular weight polyimide resin: 0.5%.

[0096] Its structural formula is as follows:

[0097]

[0098] The preparation method is the same as component (1), but the molecular weight is controlled, and the logarithmic viscosity is: 0...

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Abstract

The invention discloses a high-temperature-resistant easy-to-process thermoplastic transparent polyimide resin material with a low thermal expansion coefficient and a preparation method thereof. High-molecular-weight high-temperature-resistant thermoplastic transparent polyimide resin with a glass transition temperature being greater than 240 DEG C and a thermal expansion coefficient being less than 45ppm/K, an antioxidant, a lubricant and low-molecular-weight polyimide resin are blended and extruded to obtain aggregates, due to adoption of thelow-molecular-weight polyimide resinwith good compatibility with the thermoplastic polyimide body, the antioxidant and the lubricant, the melt index of the resin is greatly increased, the processing temperature is greatly reduced, the resin can be subjected to melt extrusion for many times subsequently, the processing stability of the resin is improved, and the material can be used for processing such as multi-time extrusion injection molding.

Description

technical field [0001] The invention relates to the technical field of thermoplastic polyimide materials, in particular to a thermoplastic transparent polyimide material and a preparation method thereof. Background technique [0002] Polyimide is a kind of resin material with excellent comprehensive properties. It has good thermal stability, excellent mechanical properties, good dimensional stability, excellent chemical stability, high breakdown voltage, low dielectric constant, high With the advantages of flame retardancy and low expansion coefficient, it is widely used in high-tech fields such as electronic appliances, aerospace, automobiles, and chemical machinery. On the other hand, due to the rigid molecular chains of polyimide and the strong interaction between molecules, it is difficult to melt the polymer, which limits the processing and application range of polyimide. Therefore, many methods have been developed to improve the performance of polyimide. Thermoplastic...

Claims

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Application Information

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IPC IPC(8): C08L79/08
CPCC08L79/08C08L2205/025C08L2201/08C08L2201/10
Inventor 方省众李青璇
Owner 宁波惠璞新材料有限公司
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