Manufacturing method of packaging structure, and packaging structure

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc. Alignment process, the effect of improving heat dissipation

Pending Publication Date: 2021-05-28
SKY CHIP INTERCONNECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, in order to achieve high integration, miniaturization and miniaturization of products, package in package (PiP), package on package (PoP) or system in package (System in Package) are generally used. , SiP) to package each component; however, the packaging structure in the prior art has a relatively complicated manufacturing method, and its heat dissipation and flow capacity are relatively weak

Method used

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  • Manufacturing method of packaging structure, and packaging structure
  • Manufacturing method of packaging structure, and packaging structure
  • Manufacturing method of packaging structure, and packaging structure

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0031] The terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least t...

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Abstract

The invention provides a manufacturing method of a packaging structure, and a packaging structure. The manufacturing method comprises the steps: providing a carrier plate, and mounting electronic components and through-flow columns on at least one surface of the carrier plate; packaging the electronic components and the through-flow columns to form a packaging body; electroplating a metal layer on the surface of one side of the packaging body to form a plurality of external pins, wherein the positions of at least part of the external pins correspond to the positions of the through-flow columns, the through-flow columns are communicated with external equipment through the external pins, and the transverse area of the external pins is larger than that of the through-flow columns. The manufacturing method is relatively simple, and the manufactured packaging structure is relatively high in heat dissipation and through-current capability.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a method for manufacturing a packaging structure and the packaging structure. Background technique [0002] In today's information society, human beings are increasingly dependent on electronic products, and electronic products are developing vigorously in the direction of high integration, miniaturization, and miniaturization. [0003] At present, in order to achieve high integration, miniaturization and miniaturization of products, package in package (PiP), package on package (PoP) or system in package (System in Package) are generally used. , SiP) to package each component; however, the packaging structure in the prior art has a relatively complicated manufacturing method, and its heat dissipation and flow capacity are relatively weak. Contents of the invention [0004] The manufacturing method of the packaging structure and the packaging structure provided ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/56H01L21/768H01L23/31H01L23/48H01L23/528H01L23/367
CPCH01L21/4825H01L21/76895H01L21/56H01L23/3157H01L23/48H01L23/528H01L23/367H01L2221/1068
Inventor 张强波张伟杰宋关强余晋磊
Owner SKY CHIP INTERCONNECTION TECH CO LTD
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