Tool and method for correcting wafer position in semiconductor fabrication tool
A semiconductor and wafer technology, which is applied in the field of tools for correcting the position of wafers in semiconductor manufacturing machines, can solve problems such as low product yield, time-consuming, film thickness, uniformity, and particle quantity, etc., to increase accuracy Degree, the effect of improving product yield
Active Publication Date: 2022-04-01
CHANGXIN MEMORY TECH INC
View PDF15 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the blind adjustment method cannot accurately adjust the wafer position, and it takes a lot of time to optimize the wafer position multiple times, which consumes a lot of time
Moreover, since the position of the wafer after blind adjustment is not very accurate, it will have an impact on the thickness, uniformity and number of particles of the film layer of the wafer after manufacturing, so that the product yield after wafer manufacturing is low
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0054] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.
[0055] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present disclosure relates to a tool and a method for correcting the position of a wafer in a semiconductor manufacturing machine. The semiconductor manufacturing machine has a chamber. One side of the chamber is provided with a wafer carrying device. The wafer can be placed on the wafer carrying device close to the chamber. and there is a gap between the wafer and the edge of the wafer carrier device, the tool includes: a cover plate, arranged on the side of the chamber away from the wafer carrier device, and covering the chamber, the cover plate has a mounting hole; transparent The plate is installed in the mounting hole, and the projection of the wafer carrying device on the transparent plate is located in the transparent plate; the first scale and the second scale are arranged on the transparent plate, and the first scale is along the first direction and away from the first direction The direction extends to the edge of the transparent plate, the second scale extends to the edge of the transparent plate along the second direction and the direction away from the second direction, and the first scale and the second scale are provided with a plurality of uniformly distributed graduation marks; wherein, The second direction intersects the first direction. The tool can accurately adjust the wafer position.
Description
technical field [0001] The present disclosure relates to the field of semiconductor technology, and in particular to a tool and method for correcting the position of a wafer in a semiconductor manufacturing machine. Background technique [0002] At present, in the field of semiconductor technology, the position of the wafer on the wafer carrier device is usually adjusted by means of blind adjustment (that is, adjustment based on experience and judgment by feeling). However, the blind adjustment method cannot accurately adjust the wafer position, and it takes a lot of time to optimize the wafer position multiple times, thus consuming a lot of time. Moreover, since the position of the wafer after blind adjustment is not very accurate, it will have an impact on the thickness, uniformity and number of particles of the film layer of the wafer after manufacture, so that the product yield rate after wafer manufacture is low. [0003] It should be noted that the information disclos...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68
CPCH01L21/68
Inventor 王志久
Owner CHANGXIN MEMORY TECH INC