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High-speed semiconductor optical communication chip based on 5G network communication

A network communication and semiconductor technology, applied in the field of high-speed semiconductor optical communication chips, can solve the problems of high real-time requirements, low integration of dual-mode communication chips, and large chip area, so as to improve service life, enhance practicability, The effect of increasing the degree of integration

Pending Publication Date: 2021-05-28
BANDWEAVER TECH CO LTD
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Problems solved by technology

[0003] In the above-mentioned mobile terminals, the GSM chip and the NB-ToT chip have their corresponding radio frequency processing modules, digital front-end modules, baseband processing modules and system modules, resulting in low integration of the dual-mode communication chip, excessive chip area, and chip size. The cost is too high. At the same time, the transmission method has the problems of large network delay and low transmission rate. It cannot meet the use requirements for scenarios with high real-time requirements or high-speed transmission.

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  • High-speed semiconductor optical communication chip based on 5G network communication

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that ...

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Abstract

The invention discloses a high-speed semiconductor optical communication chip based on 5G network communication, which comprises a system control module, a radio frequency signal processing module, an MCU chip and a 5G module, and is characterized in that the system control module is connected with the radio frequency signal processing module and the MCU chip, the MCU chip is connected with the 5G module, an embedded operation system is installed in the MCU chip, and the embedded operation system is connected with the system control module. The MCU chip is internally provided with a power supply module and the power supply module is connected with the 5G module, so that the transmission speed of the chip is increased, the network delay is reduced, the area of the communication chip is reduced, and the manufacturing cost of the communication chip is reduced.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a high-speed semiconductor optical communication chip based on 5G network communication. Background technique [0002] At present, mobile terminals (such as smart phones, tablet computers, etc.) usually include dual-mode communication chips packaged together by System In a Package (SIP) packaging technology. The dual-mode communication chips include Global System for Mobile Communications (Global System for Mobile Communications (GSM) chips and Narrow Band Internet of Things (NB-ToT) chips. [0003] In the above-mentioned mobile terminals, the GSM chip and the NB-ToT chip have their corresponding radio frequency processing modules, digital front-end modules, baseband processing modules and system modules, resulting in low integration of the dual-mode communication chip, excessive chip area, and chip size. The cost is too high, and at the same time, the transmission method has the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04W88/02H04W88/06H04B1/40
CPCH04B1/40H04W88/02H04W88/06
Inventor 赵浩张静陈博黎载红
Owner BANDWEAVER TECH CO LTD
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