Semiconductor material cutting device with positioning, damping and fixing structure

Abstract

The invention discloses a semiconductor material cutting device with a positioning, damping and fixing structure. The semiconductor material cutting device with the positioning, damping and fixing structure comprises a frame body and an operation box, mounting parts are arranged on the two sides of the frame body, a damping spring rod is arranged in a fixing plate, a fixing block is mounted at the top of the damping spring rod, a clamping block is arranged on the outer side of the fixing block, a connecting plate is installed above the clamping block, the operation box is installed on the outer side of the connecting plate, a supporting column is fixed to the middle of the operation box, a sliding block is installed above a rail, and a supporting plate is fixed to the middle of the sliding block. Compared with an existing semiconductor material cutting device, the semiconductor material cutting device has the advantages that the stability of the frame body is improved, the frame body is not prone to shaking during operation, splashing waste materials during cutting can be prevented from splashing and hurting workers, and the safety performance of the device is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor cutting devices, and in particular relates to a semiconductor material cutting device with a positioning, shock-absorbing and fixing structure. Background technique [0002] Semiconductor materials can be used to make electronic materials for semiconductor devices and integrated circuits. When in use, semiconductors need to be cut to cut the entire semiconductor material. However, the power generated by the existing semiconductor cutting device during cutting causes the entire device to shake. , affecting the accuracy of cutting, resulting in poor cutting quality. [0003] The semiconductor material cutting device currently on the market is a single main body, which is inconvenient to move and requires manpower to carry it. It is inconvenient to move when it is fixed in one position, and the device is easy to shake when cutting. The overall device is not stable enough, resulting in insuffici...

AI Technical Summary

Problems solved by technology

[0002] Semiconductor materials can be used to make electronic materials for semiconductor devices and integrated circuits. When in use, semiconductors need to be cut to cut the entire semiconductor material. However, the power generated by the existing semiconductor cutting device during cutting causes the entire device to shake. , affecting the accuracy of cutting, resulting in poor cutting quality

[0003] The semiconductor material cutting device currently on the market is a single main body, which is inconvenient to move and requires manpower to carry it. It is inconvenient to move when it is fixed in one position, and the device is easy to shake when cutting. The overall device is not stable enough, resulting in insufficient cutting accuracy. The effect of the cut semiconductor material is not good. In response to the above situation, technological innovation is carried out on the basis of the existing semiconductor material cutting device. It is easy to install and disassemble when fixed, which can improve the stability of the frame body, making it stronger and firmer, not easy to shake, and can reduce the shaking caused by the upper cutting device during work. Repair and replace the shock device to ensure that the shock absorption effect of the device can be used normally, and the height distance of the position can be adjusted conveniently according to the needs, so that the application range of the device is wider, and the protective cover can effectively prevent the spatter of waste after cutting. The impact of the environment, and effectively prevent the splashed waste from splashing the staff, increasing the safety performance of the semiconductor material cutting device

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