Bubble removing method and wafer electroplating equipment

Abstract

The invention discloses a bubble removing method and wafer electroplating equipment. The bubble removing method is used for removing bubbles on the surface of a wafer when the wafer is electroplated. The bubble removing method comprises the following steps: S10, controlling the wafer to be immersed into an electroplating pool along with a wafer clamp in a posture of inclining relative to an electroplating liquid level, and making a dead zone of the wafer clamp be located in the overflow zone of the electroplating pool; and S20, controlling the wafer clamp to move in the direction parallel to or close to the electroplating liquid level, wherein the dead zone of the wafer clamp leaves the overflow zone of the electroplating pool. According to the bubble removing method, by means of the characteristic that the liquid level of an overflow area of an electroplating pool is higher than the electroplating liquid level of the electroplating pool, the wafer clamp with the wafer is immersed into the electroplating liquid level in a face-down posture, the dead area of the wafer clamp is moved to the overflow area, bubbles in the dead area are brought out through overflow flowing of the electroplating liquid, and the purpose of eliminating bubbles is quickly and reliably achieved.

Description

technical field [0001] The invention relates to the field of wafer electroplating, in particular to a bubble removal method and wafer electroplating equipment. Background technique [0002] When the wafer enters the electroplating chamber with the fixture, it is easy to generate bubbles, and the bubbles will stay inside the wafer fixture. When the bubbles stay on the surface of the wafer to be plated, the position cannot be plated. Therefore, the bubbles The existence directly affects the quality of electroplating. [0003] Such as figure 1 As shown, in the prior art, when the wafer 2' installed on the wafer holder 1' is immersed in the plating solution of the electroplating pool in a downward posture, since the inner peripheral edge 11' of the wafer holder 1' is higher than wafer side, even if the wafer holder 1' as figure 1 If it is inclined like that, the residual gas will also form bubbles 3' when immersed in the electroplating solution, and stay between the inner per...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of complex mechanical structure, high cost and low reliability of the equipment caused by removing the bubbles located in the dead zone of the wafer fixture in the prior art, and provide a method for removing bubbles and Wafer Plating Equipment

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