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Gettering property evaluation apparatus

An evaluation device and a technology for removing defects, which can be used in measuring devices, instruments, grinding machines, etc., and can solve the problems of inability to perform comparative evaluation and dependence on evaluation results for defect removal.

Pending Publication Date: 2021-06-08
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] There is no problem when the evaluation of the removal property of the wafer is performed at the same coordinates (that is, at the same point) every time, but when the evaluation of the removal property of the wafer is performed on the entire surface of the wafer or in multiple locations, there is an evaluation of the removal performance of the wafer. The problem that results cannot be compared and evaluated depends on the shape of the metal base at each point

Method used

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  • Gettering property evaluation apparatus
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Examples

Experimental program
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no. 1 Embodiment approach 〕

[0032] The flaw removal evaluation device 1 according to the first embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view showing a wafer 100 to be evaluated by the defect removal evaluation apparatus 1 of the first embodiment. figure 2 It is a perspective view of the structural example of the defect removal evaluation apparatus 1 of 1st Embodiment. image 3 yes figure 2 Sectional view of line III-III. Figure 4 yes figure 2 A perspective view of the base member 22 of the flaw removal evaluation device 1 of .

[0033] The removal performance evaluation apparatus 1 of the first embodiment is a device for measuring and evaluating the removal performance (hereinafter referred to as removal performance) of the removal layer 110 formed on the wafer 100 . Here, the removal layer 110 is a layer that traps metal elements. In addition, in the first embodiment, the defect removal evaluation device 1 measures and ev...

no. 2 Embodiment approach 〕

[0065] A flaw removal evaluation device 1-3 according to a second embodiment of the present invention will be described with reference to the drawings. Figure 6 It is a perspective view of the structural example of the defect removal evaluation apparatus 1-3 of 2nd Embodiment. Figure 7 yes Figure 6 A perspective view of the support member 53 of the defect removal evaluation device 1-3. Figure 8 yes Figure 6 A perspective view of the base member 52 of the flaw removal evaluation device 1-3. exist Figure 6 to Figure 8 In the description, the same reference numerals are attached to the same parts as those in the first embodiment, and description thereof will be omitted.

[0066] like Figure 6 As shown, the flaw removal evaluation apparatus 1-3 of the second embodiment is obtained by changing the chuck table 20 to the chuck table 50 in the flaw removal evaluation apparatus 1 of the first embodiment. like Figure 6 As shown, the chuck table 50 includes a porous member...

no. 3 Embodiment approach 〕

[0092] A flaw removal evaluation device 1-5 according to a third embodiment of the present invention will be described with reference to the drawings. Figure 10 It is a cross-sectional view of a configuration example of the removal property evaluation apparatus 1-5 of the third embodiment. exist Figure 10 In the description, the same reference numerals are assigned to the same parts as those of the second embodiment, and description thereof will be omitted.

[0093] Such as Figure 10 As shown, the defect removal evaluation device 1-5 of the third embodiment is obtained by changing the chuck table 50 to a chuck table 50-3 in the defect removal evaluation device 1-3 of the second embodiment. device. The chuck table 50 - 3 is a member obtained by changing the reflection plate 54 into the radio wave absorber 74 in the chuck table 50 .

[0094] Like the reflector 54 of the second embodiment, the radio wave absorber 74 is disposed below the supporting member 53 . Specificall...

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Abstract

The invention provides a defect-removing performance evaluation device, which can reduce the influence of a chuck workbench for attracting and holding a wafer on the evaluation of the defect-removing performance. The gettering property evaluation apparatus includes a gettering determination unit and a chuck table. The gettering determination unit has a laser beam applying unit for applying a laser beam to a wafer, and a transmission-reception unit for applying a microwave to the wafer and receiving the microwave reflected by the wafer. The gettering determination unit determines whether or not a gettering layer including a grinding strain generated by grinding the wafer has a gettering property. The chuck table holds the wafer on a holding surface. The chuck table has a conductive nonmetallic porous member constituting the holding surface and having a property of reflecting or absorbing the microwave, and a base member provided with a negative pressure transmission passage for transmitting a negative pressure to the nonmetallic porous member.

Description

technical field [0001] The present invention relates to a flaw removal evaluation device. Background technique [0002] In recent years, in order to reduce the size and weight of device chips, etc., wafers after device formation have been processed to be thinner. However, for example, when the wafer is polished to a thickness of 100 μm or less, the removal performance for suppressing the movement of metal elements harmful to the device may be reduced, resulting in malfunction of the device. In order to solve this problem, a method has been proposed in which a removal layer that traps metal elements is formed on the wafer, and excitation light and microwaves are irradiated on the wafer to generate excess carriers, and the removal time of the removal layer is adjusted according to the decay time of the reflected microwaves. The removal performance (hereinafter referred to as removal property) was evaluated (see Patent Documents 1 and 2). [0003] Patent Document 1: Japanese ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/687
CPCH01L22/12H01L21/68757H01L21/68785B24B7/228G01R31/2831H01L21/3221H01L22/30H01L21/6838G01N21/9501
Inventor 丹野宁
Owner DISCO CORP