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RGB device with step electrode and preparation method

A technology of stepped electrodes and devices, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of unstable RGB devices and low device contrast, and achieve the effect of improving contrast and ensuring stability.

Active Publication Date: 2021-06-08
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] RGB devices have been widely used in various display products, and when RGB devices on the market are installed on circuit boards, there are often bonding wires in contact with circuit boards, resulting in instability of RGB devices
Moreover, since the RGB chip reflects more external light sources, the contrast of the device will not be high

Method used

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  • RGB device with step electrode and preparation method
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  • RGB device with step electrode and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The present embodiment provides a preparation method of an RGB device, comprising the following steps:

[0062] A. Adhere the copper foil 7 and the substrate 2 together, and punch a through hole 6 on the copper foil 7 and the substrate 2. The through hole 6 is used to place the chip and fill with low-reflection colloid, such as figure 2 shown. in, figure 2 (a) is the cross-sectional view after the copper foil and the substrate are bonded and punched, figure 2 (b) is the top view after the copper foil and the substrate are bonded and punched.

[0063] B. Process the electrode structure by etching or machining, such as image 3 shown. in, image 3 (a) is a cross-sectional view of the electrode structure and the substrate, image 3 (b) is a top view of the electrode structure and the substrate.

[0064] C. By the method of semi-etching or semi-mechanical cutting of copper foil, the conductive electrodes with stepped shape are processed, such as Figure 4 shown. ...

Embodiment 2

[0069] This embodiment provides a preparation method of an RGB device, and the preparation steps are the same as those in Embodiment 1, except that:

[0070] In step C, the method of processing the step electrode is different, and here the step electrode structure is processed by the method of mechanical cutting.

Embodiment 3

[0072] This embodiment provides a preparation method of an RGB device, and the preparation steps are the same as those in Embodiment 1, except that:

[0073] In step C, the method of processing the step electrode is different. Here, the step electrode structure is processed by the method of printing metal, such as Figure 5 shown. in, Figure 5 (a) is a cross-sectional view of the conductive electrode and the substrate, Figure 5 (b) is a top view of the conductive electrode and the substrate.

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Abstract

The invention discloses an RGB device with a step electrode and a preparation method. The RGB device comprises a carrier plate; a substrate which is arranged on the carrier plate, wherein a through hole is formed in the substrate; an RGB chip arranged on the carrier plate through the through hole; a conductive electrode which is arranged on the substrate, wherein the conductive electrode is of a step structure, the conductive electrode comprises an electrode upper surface and an electrode lower surface, the electrode upper surface is used for welding a circuit board, and the electrode lower surface is connected with the RGB chip through a bonding wire; and a low-reflection colloid used for covering the RGB chip and the bonding wire. By adopting the conductive electrode with the step structure, the condition that the bonding wire is directly contacted with the circuit board when the RGB device is mounted on the circuit board is avoided, and the stability of the circuit structure is ensured. In addition, by injecting the low-reflection colloid, the contrast ratio of the RGB device can be effectively improved. The invention can be widely applied to the technical field of LED devices.

Description

technical field [0001] The invention relates to the technical field of LED devices, in particular to an RGB device with stepped electrodes and a preparation method. Background technique [0002] RGB devices have been widely used in various display products, and when RGB devices on the market are mounted on circuit boards, there are often bonding wires in contact with the circuit board, resulting in unstable RGB devices. Moreover, since the RGB chip reflects more external light sources, the contrast ratio of the device is not high. This is some technical contradiction at present. SUMMARY OF THE INVENTION [0003] In order to solve one of the technical problems existing in the prior art at least to a certain extent, the purpose of the present invention is to provide an RGB device with stepped electrodes and a preparation method thereof. [0004] The technical scheme adopted in the present invention is: [0005] An RGB device with stepped electrodes, comprising: [0006] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/56H01L33/62
CPCH01L25/0753H01L33/48H01L33/56H01L33/62H01L2933/0033H01L2933/005H01L2933/0066
Inventor 李宗涛李家声汤勇丁鑫锐余彬海陈勇军
Owner SOUTH CHINA UNIV OF TECH