Circuit board manufacturing method

Abstract

The invention relates to the field of circuit board manufacturing, and provides a method for manufacturing a circuit board, which comprises the steps of pressing boards, drilling alignment holes, drilling auxiliary holes, copper sinking electroplating, and exposure. In the step of drilling alignment holes, at least three alignment holes are drilled on the periphery of the plate surface of the pressed blank; in the step of drilling auxiliary holes, at least one auxiliary structure is drilled on the periphery of each alignment hole , the auxiliary structure includes a plurality of auxiliary holes arranged in a circular array; in the copper plating step, copper plating is performed on each alignment hole and each auxiliary hole; in the exposure operation step, grab the center of each alignment hole as Align the reference, and then perform exposure treatment on the surface of the copper foil away from the mother board. The circuit board manufacturing method realizes layer-by-layer guarantee and improves the inter-layer alignment accuracy by improving the offset degree of the center of the alignment hole before and after electroplating, and finally improves the inter-layer alignment accuracy of the multilayer circuit board, effectively reducing the alignment deviation, Therefore, the production yield and quality reliability of the multilayer circuit board can be effectively improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for manufacturing a circuit board. Background technique [0002] In the manufacturing process of multi-layer circuit boards, the through holes drilled by the target drilling machine are usually used as alignment holes in related industries, and the exposure operation of the circuit layer is carried out by grabbing the center of the alignment hole in the subsequent process, so as to Make the holes and graphic lines of this line layer correspond to the holes and graphic lines of other line layers. [0003] However, although related industries have improved the inter-layer alignment accuracy to a certain extent by controlling the stability of material expansion and contraction, grasping the variation rules of the process to reduce variation, and improving equipment capabilities, the best inter-layer alignment accuracy in the industry is still...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a method for manufacturing circuit boards to solve the problem of poor interlayer alignment accuracy and large alignment deviations of circuit boards produced in the prior art, resulting in low production yields of circuit boards , technical problems with poor quality and reliability

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