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Medium and low temperature curing type epoxy glass polymer

An epoxy and polymer technology, applied in the field of polymer materials, can solve problems such as inability to cure and form

Active Publication Date: 2021-06-18
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing epoxy vitrimers can only be cured at high temperatures (~150°C or higher) (Science, 2011, 334, 965-968, Mater Horiz, 2016, 3, 241-247), and cannot be formed at medium and low temperatures. Bottom curing molding

Method used

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  • Medium and low temperature curing type epoxy glass polymer
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  • Medium and low temperature curing type epoxy glass polymer

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Effect test

Embodiment 1

[0022] The middle and low temperature curable epoxy glass macromolecule (vitrimer) of the present invention, according to parts by weight, consists of 50-80 parts of epoxy resin, 20-60 parts of epoxy curing agent, 20-30 parts of epoxy diluent, 1- Composed of 2 parts of catalyst, solidified at medium and low temperature.

[0023] The epoxy resin is dithiodiphenyl diglycidyl ether, the epoxy curing agent is tetraethylenepentamine, the epoxy diluent is phenyl glycidyl ether, and the catalyst is dimethylbenzyl Amine (BDMA). The medium and low temperature is 60°C.

[0024] The middle and low temperature curing epoxy glass polymer (vitrimer) can be cured at a low temperature (-20 ~ 100 ° C) temperature range, and its viscosity gradually increases with the progress of the curing reaction, such as figure 2 As shown, the system changes from liquid to solid.

[0025] The medium-low temperature curing epoxy-type glass polymer (vitrimer) can be completely cured and molded in the tempe...

Embodiment 2

[0032] The medium and low temperature curable epoxy glass macromolecule (vitrimer) of the present invention, according to parts by weight, consists of 70-100 parts of epoxy resin, 30-60 parts of epoxy curing agent, 30-50 parts of epoxy diluent, 2- Composed of 3 catalysts, solidified at medium and low temperatures.

[0033] The epoxy resin is dithiodiphenyl diglycidyl ether, the epoxy curing agent is diethylenetriamine, the epoxy diluent is butyl glycidyl ether, and the catalyst is dimethylbenzyl Amine (BDMA). The medium and low temperature is 40°C.

[0034] The middle and low temperature curing epoxy glass polymer (vitrimer) can be cured at a low temperature (-20 ~ 100 ° C) temperature range, and its viscosity gradually increases with the progress of the curing reaction, such as figure 2 As shown, the system changes from liquid to solid.

[0035] The medium-low temperature curing epoxy-type glass polymer (vitrimer) can be completely cured and molded in the temperature rang...

Embodiment 3

[0042] The medium and low temperature curable epoxy glass polymer (vitrimer) of the present invention consists of 50-60 parts of epoxy resin, 20-40 parts of epoxy curing agent, 20-30 parts of epoxy diluent, 1- Composed of 2 parts of catalyst, solidified at medium and low temperature.

[0043] The epoxy resin is dithiodiphenyl diglycidyl ether, the epoxy curing agent is tetraethylenepentamine, the epoxy diluent is phenyl glycidyl ether, and the catalyst is triazidine Ring (TBD). The medium and low temperature is 50°C.

[0044] The middle and low temperature curing epoxy glass polymer (vitrimer) can be cured at a low temperature (-20 ~ 100 ° C) temperature range, and its viscosity gradually increases with the progress of the curing reaction, such as figure 2 As shown, the system changes from liquid to solid.

[0045] The medium-low temperature curing epoxy-type glass polymer (vitrimer) can be completely cured and molded in the temperature range of medium-low temperature (-20...

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Abstract

The invention discloses a medium and low temperature curing type epoxy glass polymer which is formed by curing 50-100 parts by weight of epoxy resin, 20-80 parts by weight of an epoxy curing agent, 20-100 parts by weight of an epoxy diluent and 1-5 parts by weight of a catalyst at a medium and low temperature. The epoxy glass polymer capable of being cured at medium and low temperatures and disassembled at medium and low temperatures can be cured and formed at medium and low temperatures, and various dynamic characteristics of self-repairing, disassembly, reprocessing and forming and the like of epoxy glass polymer materials can be presented.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a medium-low temperature curing type epoxy glass polymer. Background technique [0002] As a typical thermosetting polymer, epoxy has the advantages of excellent mechanical properties, stable structure, and solvent resistance due to the formation of a three-dimensional crosslinked network after it is completely cured. However, the body-shaped cross-linked structure of epoxy makes it impossible to deform, repair and disassemble after its shape is fixed. Unlike thermosetting polymers, thermoplastic polymers such as linear or branched polyethylene or polypropylene can be disassembled (dissolved) in solvents, and can also be flowed, repaired and reprocessed at high temperatures, but their mechanical properties , Structural stability, heat resistance and solvent resistance are far inferior to thermosetting polymers such as epoxy. [0003] Epoxy glass polymer (vitrimer), ...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/66
CPCC08G59/5006C08G59/504C08G59/66
Inventor 陈茂赵秀丽周琳吴冶平陈忠涛张银宇
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS