Thermal imaging image attenuation device, control module and thermal imaging equipment

An attenuation device and thermal imaging technology, applied in the field of infrared imaging, can solve the problems of high cost, large volume, and low precision of the thermal image of the measured high temperature target, and achieve the effect of convenient position adjustment

Active Publication Date: 2022-05-31
HANGZHOU HIKMICRO SENSING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing attenuation device is bulky and expensive, and the working position of the attenuation sheet of the attenuation device is fixed, resulting in low accuracy of the thermal image of the measured high-temperature target

Method used

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  • Thermal imaging image attenuation device, control module and thermal imaging equipment
  • Thermal imaging image attenuation device, control module and thermal imaging equipment
  • Thermal imaging image attenuation device, control module and thermal imaging equipment

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Embodiment Construction

[0028] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with this application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as recited in the appended claims.

[0029] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will also be understood that the term "and / or" as...

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Abstract

The present application provides a thermal imaging image attenuation device, a control module and a thermal imaging device. The thermal imaging image attenuation device includes a base, a driving component mounted on the base, a cantilever assembly movably connected to the base, and an attenuation sheet mounted on the cantilever assembly, the attenuation sheet is located outside the base , the driving component is drivingly connected with the cantilever assembly, and the cantilever component moves relative to the base under the driving of the driving component to adjust the working position of the damping sheet. The damping sheet is installed on the cantilever assembly and moves with the cantilever assembly. By adjusting the relative position between the cantilever assembly and the base, the working position of the damping sheet can be changed, and the position adjustment is convenient.

Description

technical field [0001] The present application belongs to the technical field of infrared imaging, and relates to a thermal imaging image attenuation device, a control module and a thermal imaging device. Background technique [0002] The thermal imager uses an infrared detector and an optical imaging objective lens to receive the infrared radiation energy of the measured target, and reflects the energy distribution pattern to the photosensitive element of the infrared detector, thereby obtaining an infrared thermal image, wherein the thermal image is related to the surface of the object. The heat distribution field corresponds to . [0003] When the measured target collected by the thermal imager is a high-temperature target with a temperature exceeding 550 degrees, the thermal imager cannot directly receive the infrared radiation energy of the measured target. In the related art, the thermal imager needs to be equipped with a corresponding attenuation device to increase t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/0803G01J5/07G01J5/04G01J5/48
CPCG01J5/0205G01J5/047G01J2005/0077G01J5/0816
Inventor 徐伟
Owner HANGZHOU HIKMICRO SENSING TECH CO LTD
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