Transfer method and transfer system of micro device

Abstract

The invention relates to a transfer method and a transfer system of micro devices. The method comprises the following steps of: dividing first laser into second laser and third laser; providing the second laser to a laser lift-off assembly, so that the laser lift-off assembly lifts off a micro device from a substrate; and providing the third laser to an optical tweezers adjusting assembly, and picking up and transferring the stripped micro device to a back plate through the optical tweezers adjusting assembly. Through the method, the micro device is only in contact with the laser, the micro device can be prevented from being damaged, and the method can be suitable for transfer of small-size micro devices. Therefore, the micro device can be stripped from the substrate and the stripped micro device can be picked up and transferred only by using the first laser for light splitting, so that the number of laser assemblies can be reduced, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of micro-device transfer, in particular to a micro-device transfer method and transfer system. Background technique [0002] At present, the biggest technological bottleneck in the micro-LED (Micro-LED) chip manufacturing process is the chip transfer link. The existing chip transfer methods mainly use technologies such as electrostatic force, van der Waals force, magnetic force, fluid self-assembly, and roller transfer printing. However, the above-mentioned technologies are all in direct contact with the chip, and all have the disadvantage of damaging the chip. [0003] On the other hand, as the size of Micro-LED chips gradually shrinks, all the above transfer methods will become more and more difficult. According to industry development forecasts, applications such as virtual reality and enhanced display require micro-device sizes less than or equal to 5 microns to achieve better visual effects, which pose...

AI Technical Summary

Problems solved by technology

However, the above-mentioned technologies are in direct contact with the chip, and all have the disadvantage of damaging the chip.

[0003] On the other hand, as the size of Micro-LED chips gradually shrinks, all the above transfer methods will become more and more difficult

According to industry development forecasts, applications such as virtual reality and enhanced display require micro-device sizes less than or equal to 5 microns to achieve better visual effects, which poses a huge challenge to existing technology routes

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