Antenna packaging module and electronic equipment

A technology for electronic equipment and molding, which is applied to antennas, antenna supports/mounting devices, antenna arrays, etc., can solve problems such as small space range, and achieve the effect of increasing the space range and increasing the coverage direction

Pending Publication Date: 2021-06-18
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The embodiment of the present application provides an antenna packaging module and electronic equipment, which can solve the problem that the end-

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  • Antenna packaging module and electronic equipment
  • Antenna packaging module and electronic equipment
  • Antenna packaging module and electronic equipment

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[0031] Next, the technical scheme in the present application will be clear and completely, and the embodiments described herein are described herein, and not all of the embodiments of the present disclosure, not all of the embodiments of the present application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative labor, are the scope of the present application.

[0032] The terms "first", "second", and the like in the specification of the present application are used to distinguish between similar objects, not to describe a particular order or ahead order. It is to be understood that the data such as use can be interchanged in appropriate, so that the embodiments of the present application can be implemented in the order other than those illustrated or described herein, and "first", "second", etc. Objects are usually a class, and the number of objects is not limited, such as one of the first object, or...

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Abstract

The invention discloses an antenna packaging module and electronic equipment, and belongs to the technical field of antennas. The antenna packaging module comprises a radio frequency integrated circuit, an array antenna layer connected with the radio frequency integrated circuit, a feeder line layer connected with the array antenna layer, and a power management integrated circuit connected with the radio frequency integrated circuit. The array antenna layer comprises a first antenna array and a second antenna array, and the radiation directions of the first antenna array and the second antenna array are different; and the antenna radiation directions of the first antenna array and the second antenna array are parallel to the plane where the array antenna layer is located. The antenna array with the multiple radiation directions is arranged in the antenna packaging module, and the antenna radiation directions of the antenna array are parallel to the plane where the array antenna layer is located so that the coverage direction of the antenna packaging module is increased, and a space range covered by the antenna packaging module is enlarged.

Description

technical field [0001] The application belongs to the technical field of antennas, and in particular relates to an antenna packaging module and electronic equipment. Background technique [0002] In all-metal, high screen-to-body ratio, ultra-thin body, communication with multiple antennas has become the current mainstream and future trend of terminals, and with the development of 5G (fifth generation mobile communication), the design of millimeter wave antennas is gradually being introduced To some small mobile terminals, such as mobile phones, tablets, and even notebook computers, so while maintaining the overall competitive size of the system, the effective radiation space allocated by each antenna is often reduced, which in turn reduces the performance of the antenna. Deteriorating the user's wireless experience. Or, to accommodate multiple discrete antennas, the overall volume of the system is increased, thereby reducing the overall competitiveness of the product. [...

Claims

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Application Information

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IPC IPC(8): H01Q21/00H01Q1/36H01Q1/50H01Q23/00H01Q1/22
CPCH01Q21/00H01Q1/36H01Q1/50H01Q23/00H01Q1/22
Inventor 邾志民简宪静王义金丁杰刘洋
Owner VIVO MOBILE COMM CO LTD
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