Probe for chip testing and chip testing device

Abstract

The present invention relates to the technical field of chip testing, in particular to a probe for chip testing and a chip testing device. The probe for chip testing includes a probe holding body, which is arranged in a socket housing. There is a mounting hole; the first spring is passed through the mounting hole, and one end of the first spring is in contact with the bottom surface of the mounting hole; the probe needle is passed through the mounting hole at one end. hole, and abut against the other end of the first spring, the other end of the probe needle protrudes relative to the probe hole on the socket housing, and the probe needle can move along the mounting hole Axial reciprocating movement; the second spring is sheathed on the probe holding body, and one end can abut against the probe holding body, and the other end abuts against the socket housing. The invention can ensure the stable contact between the probe holding body and the socket shell, thereby meeting the test requirements.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip testing probe and a chip testing device. Background technique [0002] As the chip signal transmission speed is getting faster and faster, the requirements for the chip test socket are getting higher and higher. High-speed signals require not only a matching distance between the grounded probe and the high-speed signal, but also more and more requirements for the ground loop. short. The traditional probe structure adopts an ordinary double-action or single-action structure. During the actual working process of the probe with the above structure, the probe holder moves in the test socket housing, resulting in a gap between the probe holder and the socket housing. Contact between bodies is random. Therefore, it will have a great impact on high-speed signals, resulting in a relatively large loss of signal transmission capability and waveform distortion when the chip is...

AI Technical Summary

Problems solved by technology

The traditional probe structure adopts an ordinary double-action or single-action structure. During the actual working process of the probe with the above structure, the probe holder moves in the test socket housing, resulting in a gap between the probe holder and the socket housing. Contact between bodies is random

Therefore, it will have a great impact on high-speed signals, resulting in a relatively large loss of signal transmission capability and waveform distortion when the chip is tested at high-speed frequencies, which cannot meet the test requirements.

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