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Radiator structure with combined fins and electronic thermolator

An electronic thermostat and radiator technology, which is applied to instruments, electrical components, electrical digital data processing, etc., can solve problems such as difficulty in processing fins, and achieve the effects of low production cost, large heat dissipation area, and simple manufacturing process.

Pending Publication Date: 2021-06-22
SHENZHEN COFFICES ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problems of increasing the heat exchange area of ​​the fins of the radiator, overcoming the difficulty in processing the fins due to the increase in the density of the fins, increasing the manufacturing cost and improving the heat dissipation efficiency of the fan to the fins, the invention discloses a combination Finned radiator structure and an electronic thermostat designed using the radiator

Method used

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  • Radiator structure with combined fins and electronic thermolator
  • Radiator structure with combined fins and electronic thermolator
  • Radiator structure with combined fins and electronic thermolator

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Embodiment Construction

[0027] Referring to the accompanying drawings, a radiator structure with combined fins includes: a housing, a fan and a fin radiator.

[0028] The fin radiator includes: an inner fin radiator 1 and an outer fin radiator 2 .

[0029] The inner fin radiator 1 includes: inner upper ring 1-1, inner lower ring 1-2 and a set of inner fins 1-3, the inner upper ring 1-1 and inner lower ring 1- 2 coaxial arrangement, the set of inner fins 1-3 are evenly distributed along the circumferential direction on the inner wall of the inner upper ring 1-1 and the inner lower ring 1-2;

[0030] The outer fin radiator 2 includes: an outer upper ring 2-1, an outer lower ring 2-2 and a set of outer fins 2-3, and the outer upper ring 2-1 and outer lower ring 2- 2 are coaxially arranged, and the set of outer fins 2-3 are uniformly distributed on the outer walls of the outer upper ring 2-1 and the outer lower ring 2-2 along the circumferential direction.

[0031] The radiator adopts the split structu...

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Abstract

A radiator structure with combined fins and an electronic thermolator solve the technical problems of increasing the heat exchange area of the fins of the radiator, reducing the manufacturing cost and improving the heat dissipation efficiency. A fin radiating body of the radiator with the combined fins comprises an inner fin radiating body and an outer fin radiating body, the outer fin radiating body coaxially sleeves the inner fin radiating body, uniform hot air flowing gaps are formed between a set of inner fins and a set of outer fins, and the fan is arranged in the outer fin radiating body. The electronic thermolator comprises a heater shell, an electronic cold and hot plate, an electronic cold and hot plate radiator and a temperature guide plate, and the heater shell, and the electronic cold and hot plate and the electronic cold and hot plate radiator are installed in the heater shell. The inner fin radiating body and the outer fin radiating body are simple in processing and manufacturing process and low in cost, the inner fin radiating body and the outer fin radiating body are large in radiating area, high in radiating efficiency and small in size, the radiating efficiency is improved by 25%, and the electronic thermolator manufactured through the radiator is small in size and high in efficiency.

Description

technical field [0001] The invention relates to a radiator used for electronic chips and an electronic thermostat for heating or cooling manufactured by using the radiator, in particular to a radiator structure with combined fins. Background technique [0002] With the popularization and application of electronic products, the operating temperature of the electronic chip, the core component of the electronic product, must be adjusted to the ambient temperature of the electronic chip. For example, when the CPU in the computer is working, it is necessary to dissipate heat from the CPU to ensure the normal operation of the CPU. When the electronic cold and hot plate is used for heating work, it is necessary to perform air heat circulation on the cooling surface of the electronic cold and hot plate, and when the electronic cold and hot plate is used for cooling work, it is necessary to perform air cooling circulation on the cooling surface of the electronic cold and hot plate. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20H05K7/20172H05K7/2039
Inventor 吕婷婷吕罗标
Owner SHENZHEN COFFICES ELECTRONICS CO LTD