Baking equipment for electronic component processing

A technology for electronic components and baking equipment, applied in lighting and heating equipment, drying, dryers, etc. Uneven baking and other problems, to achieve the effect of stable air pressure, increasing the number of places, and easy access

Inactive Publication Date: 2021-06-25
浙江立昕科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Electronic components often need to be baked during processing and production. Baking processing requires the help of baking processing equipment. The existing electronic component baking equipment causes uneven baking of electronic components due to design defects, and the baking rate Slow and unable to sort and bake multiple electronic components that are baked at the same time, which affects the processing efficiency and quality of electronic components

Method used

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  • Baking equipment for electronic component processing
  • Baking equipment for electronic component processing
  • Baking equipment for electronic component processing

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Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals.

[0021] It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0022] In order to make the content of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0023] combined with Figure 1-4 , a baking equipment for proc...

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PUM

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Abstract

The invention discloses baking equipment for electronic component processing. The baking equipment for electronic component processing comprises a baking box, a partition plate is arranged at the bottom of an inner cavity of the baking box and divides the inner cavity of the baking box into a baking cavity and an assembly cavity, a driving shaft is rotationally arranged between inner cavities of the assembly cavity, two driving bevel gears are arranged on the driving shaft, two rotating shafts are rotationally arranged on the partition plate, driven bevel gears are arranged at the bottom ends of the two rotating shafts, a plurality of layers of mounting frames are arranged on the circumferences of the rotating shafts, placing baskets are arranged on the mounting frames, air inlet boxes with the two ends open are arranged on the two sides of the baking box, ventilation openings communicated with the air inlet boxes are formed in the side wall of the baking box, an air inlet fan is arranged in each air inlet box, a heating wire located between each air inlet fan and the corresponding ventilation opening is arranged in the corresponding air inlet box, an exhaust pipe is arranged above the baking box, and an exhaust fan is arranged in the exhaust pipe. Compared with the prior art, the baking equipment has the advantages that baking is uniform, and electronic components can be baked in a layered and classified mode.

Description

technical field [0001] The invention relates to the technical field of processing electronic components, in particular to a baking device for processing electronic components. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain components in industries such as electrical appliances, radios, and instruments, such as electric transistors, The general term for hairsprings, springs and other sub-devices. Common ones include diodes, etc. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, relays, printed cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B11/18F26B21/00F26B23/00F26B25/00F26B25/18
CPCF26B11/18F26B21/001F26B21/003F26B21/004F26B23/00F26B25/007F26B25/18
Inventor 南阁
Owner 浙江立昕科技有限公司
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