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A needle blunt cleaning device for LED chip electrical testing

A technology for LED chips and cleaning equipment, which is applied to cleaning methods using tools, metal processing equipment, grinding/polishing equipment, etc. It can solve the problems of affecting detection accuracy, large adsorption force of probe tip, and incomplete cleaning, etc., to achieve The fine grinding speed is accelerated, the grinding effect is increased, and the smoothness is improved

Active Publication Date: 2021-08-03
琉明光电(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although there will be a correction and compensation process after the probe is cleaned, the passivation of the probe will not be processed, which will affect the accuracy of subsequent detection. Moreover, in the prior art, there are often situations where the cleaning is not thorough, and there is a large adsorption force on the probe tip. The debris, the general bristles are more difficult to clean such debris

Method used

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  • A needle blunt cleaning device for LED chip electrical testing
  • A needle blunt cleaning device for LED chip electrical testing
  • A needle blunt cleaning device for LED chip electrical testing

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Embodiment Construction

[0027]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-7 , the present invention provides technical solutions:

[0029] A needle blunt-reducing cleaning device for electrical testing of LED chips, used for cleaning and grinding the needle head of a probe 1, the blunt-reducing cleaning device includes a cleaning sheet 2, a base 3 and a brush assembly 5, the cleaning sheet 2 and the brush assembly 5 Installed on the abutment 3, the abutment 3 has a lifting drive. like figure 1 As shown, after ...

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Abstract

The invention discloses a blunt-reducing cleaning device for needles used for LED chip electrical testing, which is used for cleaning and grinding probe needles. The blunt-reducing cleaning device includes a cleaning sheet, a base, and a brush assembly. On the abutment, the abutment has a lifting drive. The blunt-reducing cleaning equipment also includes a fine grinding assembly, which is arranged on the side of the abutment. The fine grinding assembly includes a bottom shell, a push rod, a wheel frame, a grinding wheel, and a bearing. Two push rods are installed on the inner wall surface of the bottom shell, and the push rod is another The wheel frame is installed at one end, and the two ends of the grinding wheel are mounted on the wheel frame through bearings. The axis of the push rod, the axis of the grinding wheel, and the axis of the probe are located in the same plane. The push rod has a telescopic structure, and the rotation of the grinding wheel on the wheel frame has a rotation damping structure. . The surface of the grinding wheel is provided with spiral first protrusions and second protrusions, the helical directions of the first protrusions and the second protrusions are opposite, and the connecting position of the first protrusions and the second protrusions is located at three within one-half of the length.

Description

technical field [0001] The invention relates to the technical field of probe cleaning for electrical property detection, in particular to a needle blunt cleaning device for electrical property detection of LED chips. Background technique [0002] After the LED chip is manufactured, it needs to be picked out by electrical testing. During the electrical testing, the metal probe is contacted with the electrode on the surface of the chip and energized to judge the quality. The main process includes: setting the environment, point measurement and alarm, cleaning, correction, compensation, returning to the abnormal point and point measurement again, and the end. [0003] Among them, in the spot measurement alarm stage, the system will alarm for unqualified points, and there are errors in the alarm. Influence, detection errors; or when the probe moves on the chip, the tip of the probe will pull the upper surface of the chip and cause wire drawing, which will cause the positive and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R3/00B08B1/00B24B19/16
CPCG01R1/06711G01R3/00B24B19/16B08B1/12
Inventor 林永祥
Owner 琉明光电(常州)有限公司