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Chip electrical property test probe head alignment method and system, storage medium and terminal

A technology of electrical testing and probe heads, which is applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of reduced chip reliability, reduced lifespan, and inability to guarantee the accuracy of probe cards and probe heads. Achieve the effect of improving chip reliability and prolonging service life

Active Publication Date: 2021-06-25
SIEN QINGDAO INTEGRATED CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the current ordinary optical method for alignment, the accuracy of the movement of the probe card and the probe head cannot be guaranteed visually, and the alignment process needs to be accurate to the size of a single pad, and it needs to be aligned from the first pad to the The last pad, and the position of the first or last pad is random and not fixed, so all the above-mentioned alignment requirements cannot be well met, resulting in part or all of the contact points between the probe head and the corresponding chip pad being out of place. The center of the pad and / or the contact between the probe tip and the pad cannot be exactly the same, which will eventually lead to reduced chip reliability and damage to the probe tip, reducing its life

Method used

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  • Chip electrical property test probe head alignment method and system, storage medium and terminal
  • Chip electrical property test probe head alignment method and system, storage medium and terminal
  • Chip electrical property test probe head alignment method and system, storage medium and terminal

Examples

Experimental program
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Effect test

Embodiment 1

[0077] This embodiment provides a method for alignment of chip electrical test probe heads, such as Figure 4 shown, including the following steps:

[0078] Obtain a chip reference image, the chip reference image is that when the chip 1 is electrically tested, all the probe heads 3 on the probe card are located in the center of the corresponding chip pad 2 and are in the same position as the pad 2 The two-dimensional plane image of the chip 1 when the contact degree is the same;

[0079] Acquiring a real-time image of a chip, the real-time image of the chip is a real-time two-dimensional plane image of the chip 1 during the alignment process;

[0080] Aligning, comparing the real-time image of the chip with the reference image of the chip in the same plane, and using the reference image of the chip as a reference, it is obtained that when the real-time image of the chip and the reference image of the chip are to be superimposed The probe card requires variable parameter info...

Embodiment 2

[0127] This embodiment provides a chip electrical test probe head alignment system 100, such as Figure 6 As shown, system 100 includes:

[0128] The chip reference image acquisition module 101 is used to obtain the chip reference image, and the chip reference image is that when the chip 1 is electrically tested, all the probe heads 3 on the probe card are located at the center of their corresponding chip pads 2 and the two-dimensional plane image of the chip 1 when the degree of contact with the pad 2 is the same;

[0129] The chip real-time image acquisition module 102 is used to acquire the chip real-time image, and the chip real-time image is a real-time two-dimensional plane image of the chip 1 during the alignment process;

[0130] Alignment module 103, for comparing the real-time image of the chip with the reference image of the chip in the same plane, and using the reference image of the chip as a reference, it is obtained that the real-time image of the chip is compa...

Embodiment 3

[0133] This embodiment provides a computer-readable storage medium, the storage medium stores at least one computer program, and when the computer program is executed in a processor, the chip electrical test probe described in the first embodiment above is implemented. Head alignment method.

[0134] Optionally, the storage medium includes ROM / RAM, magnetic disk, optical disk or flash firmware (SSD).

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Abstract

The invention provides a chip electrical test probe head alignment method and system, a storage medium and a terminal, the chip electrical test probe head alignment method realizes automatic alignment of the probe head by acquiring a chip reference two-dimensional image and a chip real-time two-dimensional image and enabling the two images to coincide, the method is convenient and fast, and the efficiency is high. The method can simultaneously ensure that all the probe heads on the probe card are located in the centers of the corresponding pads and have the same contact degree with the pads, can effectively improve the reliability of the chip, and prolongs the service life of the probe heads.

Description

technical field [0001] The invention relates to the technical field of chip electrical testing, in particular to a chip electrical testing probe head alignment method, system, storage medium and terminal. Background technique [0002] With the rapid development of semiconductor manufacturing technology, the integration level of IC devices has increased rapidly, and the difficulty of technical requirements has also increased correspondingly when testing the electrical properties of chips. [0003] Since the probe card used to test the electrical properties of the chip is a complex three-dimensional structure, which contains multiple probes with probe heads, and the surface of the chip is a smooth plane, each probe head is required to All probes must be in contact with the corresponding chip pads and each contact point is in the center of the pads. At the same time, all probe heads must have the same degree of contact with the pads. Only when the above requirements are met can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01B11/00G06F17/12
CPCG01R31/2887G01B11/002G06F17/12
Inventor 王津洲
Owner SIEN QINGDAO INTEGRATED CIRCUITS CO LTD