Thin-wall component space envelope forming buckling deformation prediction method

Abstract

The invention relates to a thin-wall component space envelope forming buckling deformation prediction method, which comprises the following steps: firstly, determining the geometric dimension of a time-varying contact area between an envelope model and a blank in a space envelope forming process, and calculating the stress of any position of the blank contact area part under a specific coordinate system; and on this basis, calculating the stress of any position of the non-contact area part of the blank, constructing a warping equilibrium differential equation of the non-contact area part of the blank, solving the warping equilibrium differential equation by combining boundary conditions of the non-contact area part of the blank, and obtaining the space envelope forming warping amount of the thin-wall component. According to the method, the spatial envelope forming buckling deformation of the high-performance thin-wall component can be accurately predicted, so that the spatial envelope forming precision of the thin-wall component is improved, and a basis is provided for optimal design of spatial envelope forming process conditions of the thin-wall component.

Description

technical field [0001] The invention relates to the field of thin-wall component manufacturing, and more specifically, to a method for predicting warpage deformation of thin-wall component space envelope forming. Background technique [0002] Thin-walled components have the characteristics of light weight and large bearing capacity, and are widely used in aerospace fields such as wings, fuselages, and fuel storage tanks. At present, the main manufacturing method of thin-walled components is mechanical processing, but this method has problems such as poor performance, low processing efficiency, low material utilization rate, and high production cost. [0003] The space envelope forming method of thin-walled components is a new forming method for thin-walled components, which has the advantages of small forming load, high forming efficiency and excellent component performance. However, thin-walled components are small in thickness and large in diameter, and are prone to warpi...

AI Technical Summary

Problems solved by technology

However, thin-walled components are small in thickness and large in diameter, and are prone to warping deformation under the eccentric load of the space envelope forming envelope mold, which affects the precision of the component, and even causes the component to be folded, broken and scrapped. Accurate and efficient prediction of warping deformation is the realization of Prerequisites for Space Envelope Forming of High Performance Thin-Walled Components

At present, there is no report on the warpage deformation prediction method of thin-walled components space envelope forming

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