Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit repairing method of printed circuit board

A printed circuit board, circuit board technology, applied in the directions of printed circuit, printed circuit maintenance/correction, printed circuit manufacturing, etc., can solve the problem of increasing production costs, low production yield of printed circuit boards, and inability to repair curved lines with high precision. Lines and other issues to achieve the effect of meeting the accuracy requirements and high accuracy

Pending Publication Date: 2021-06-25
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the production yield of printed circuit boards is low, which indirectly increases the production cost
The current line repair method is relatively simple, using the welding wire bridging line disconnection scheme, this method cannot repair curved lines and high-precision lines below 100 μm

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit repairing method of printed circuit board
  • Circuit repairing method of printed circuit board
  • Circuit repairing method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a circuit repairing method for a printed circuit board. The method comprises the following steps of: detecting a circuit defect, and acquiring position information and shape information of the circuit defect; applying a peelable layer on the surface of the circuit board, and curing the peelable layer; according to the position information and the shape information of the circuit defect, removing the peelable layer covering the surface of the circuit defect by adopting laser; applying a conductive material at the circuit defect position and curing the conductive material; and tearing off the peelable layer. According to the circuit repairing method of the printed circuit board, when the peelable layer is torn off, the conductive material on the periphery of the circuit defect can be peeled off along with the peelable layer, due to the fact that the precision of eliminating the peelable layer at the circuit defect position through laser is high, the circuit defect repairing precision is high, the precision requirement of the circuit can be met, and the method is suitable for circuits with various shapes and sizes.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and more specifically relates to a circuit repair method of a printed circuit board. Background technique [0002] A printed circuit board is a circuit substrate with printed wiring, which is used to mount and connect circuit components. In the manufacturing process of printed circuit boards, due to the high resolution of the conductive lines and the difficulty of the process, various manufacturing defects will appear in the process of making conductive lines. Most of the defects of conductive lines are line damage, Dimples, air holes, short circuits, etc. In this way, the production yield of the printed circuit board is low, which indirectly increases the production cost. The current line repair method is relatively simple to use a welding wire bridging line disconnection scheme. This method cannot repair curved lines and high-precision lines below 100 μm. Contents of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/28H05K3/22
CPCH05K3/225H05K3/28H05K3/288H05K2203/173
Inventor 郭冉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD