Method for producing patch applied to SMT
A patch and tin sheet technology, which is applied in the direction of assembling printed circuits, printed circuits, electrical components, etc. with electrical components, can solve the problems of difficulty, solder volume, shape and volume of solder joints, etc., and achieve strong soldering and soldering effect Good, good results
Pending Publication Date: 2021-06-25
深圳市森瑞达贴装技术有限公司
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Problems solved by technology
However, trends in miniaturization such as thinner steel plates and closer-packed components make this more difficult. Solder volume, drop test results, flux residue issues, solder joint shape and volume are all big problems for soldering
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[0025] The implementation of the present application will be described in detail below with reference to the accompanying drawings and examples, so as to fully understand and implement the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects.
[0026] Such as figure 1 , figure 2 As shown, the present invention provides a method for applying SMT patch production, characterized in that, a method of applying SMT patch production, characterized in that, comprises the following steps:
[0027] S1: Calculate the amount of tin;
[0028] S2: During the SMT process, print solder paste on the pad;
[0029] S3: Place the tin sheet on the solder paste with a placement machine;
[0030] S4: During the reflow soldering process, the solder paste melts first, and the molten solder paste pulls the tin sheet and gradually melts the tin sheet, and the tin sheet finally melts into the printing solder paste.
[00...
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The invention relates to an SMT patch production technology, in particular to a method for producing a patch applied to SMT. According to the invention, a Solder Fortilization@soldering lug is a rectangular alloy piece which does not contain a soldering flux at all, and the Solder Fortilization@soldering lug needs to be used together with soldering paste when used; the Solder Fortilization@soldering lug and the soldering paste are made of the same alloy material, and are also identical in reflow temperature; and no special spacing requirement exists in use. The method comprises the steps that solder paste is firstly printed, then a tin sheet is placed on the solder paste, the molten solder paste can pull a tin sheet and gradually melt the tin sheet in a reflow soldering process, and finally, the tin sheet can be finally molten into attached solder paste. Compared with the prior art, the size of a welding flux is increased, a drop test result is obviously enhanced, the problem of soldering flux residues is effectively reduced, and the shape and size of a welding point are improved.
Description
technical field [0001] The invention relates to the field of SMT patch production, in particular to a method for applying SMT patch production. Background technique [0002] With the rapid development of modern technology, people's living conditions are getting better and better. More and more electronic products have entered the homes of ordinary people and gradually become an indispensable existence. Gradually, people's requirements for electronic products It is no longer usable and effective in the past, but has become easy to use and beautiful. The production technology of many electronic products has also been continuously improved with the advancement of science and technology, changing the traditional image of big, clumsy and heavy in the past. Smaller and smaller, thinner and thinner TVs, etc.; but the problem is also very complicated, the repair and maintenance of electronic products has become a big problem in modern people's life, in order to ensure that the solde...
Claims
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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/043
Inventor 孔令平
Owner 深圳市森瑞达贴装技术有限公司