Resin composition, resin film, circuit material and printed circuit board
A technology of resin composition and circuit, which is applied in the direction of printed circuit, circuit substrate material, printed circuit parts, etc., and can solve problems such as reduced adhesion performance and failure
Active Publication Date: 2021-07-06
GUANGDONG SHENGYI SCI TECH
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This way of using thermosetting PPO is cured under high temperature conditio
Method used
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The invention relates to a resin composition, a resin film, a circuit material and a printed circuit board. The resin composition is prepared from unmodified polyarylether, unsaturated bond-containing metal salt, a co-curable monomer, an initiator and an optional elastomer block copolymer. The resin composition provided by the invention is relatively good in coating manufacturability, good in compatibility, not easy to separate out and relatively wide in applicable lamination temperature range, the applicable lamination temperature range can be 190-260 DEG C, and after the resin composition is laminated with a general low-polarity material, the peel strength is relatively high, particularly, the retention rate of the peel strength after MOT is very high, and the heat resistance and the dielectric property are excellent.
Description
technical field [0001] The invention relates to the technical field of electronic materials, in particular to a resin composition, a resin film, a circuit material and a printed circuit board. Background technique [0002] At present, high polar materials are used in circuit materials to improve the bonding force between the dielectric layer and copper foil, such as plates with a large amount of -OH, -NH and other epoxy curing systems. These strong polar components -OH, -NH Although the adhesion between the copper foil and the dielectric layer has been greatly improved, due to its strong polarity, the dielectric tangent loss value is relatively high. It is used in high-frequency and high-speed circuits, resulting in large signal loss. It is more suitable for power amplifier materials. It is to generate a large amount of heat, causing the device temperature to be too high. At present, in the high-frequency and high-speed field, low-polarity olefin materials are used to reduc...
Claims
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Login to View More IPC IPC(8): C09J4/06C09J4/02C09J11/04C09J11/06C09J11/08H05K1/03
CPCC09J4/06C09J11/04C09J11/06C09J11/08H05K1/036
Inventor 介星迪颜善银刘潜发许永静
Owner GUANGDONG SHENGYI SCI TECH
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