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Coating for heat dissipation on the surface of led heat sink

A heat sink and coating technology, applied in the direction of reflection/signal coatings, coatings, etc., can solve the problems of high power LED light source heat generation, LED light source life, poor heat dissipation, etc., to achieve good coating process, protection The effect of good equipment and convenient construction

Active Publication Date: 2016-06-01
NINGBO AISHI ELECTRIC EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the higher requirements of energy saving, emission reduction and environmental protection, more and more LED light sources are used to replace traditional light sources; however, high-power LED light sources generate a lot of heat, and if the heat dissipation is not timely, it is easy to have a great impact on the life of LED light sources. influences
The LED light source and the substrate are bonded and welded together. The traditional heat dissipation mainly uses heat-dissipating resin at the bonding point to dissipate heat. However, as the temperature of the bonding point changes repeatedly, it is easy to affect the performance of the resin, causing the resin to age and peel off. , poor cooling effect, increased energy consumption

Method used

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  • Coating for heat dissipation on the surface of led heat sink
  • Coating for heat dissipation on the surface of led heat sink

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Experimental program
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Embodiment

[0025] The preparation method is as follows:

[0026] (1) Weigh each component of the formula ratio, then firstly add carbon nanotubes to ethanol with a temperature of 50-80 ° C, and stir evenly;

[0027] (2) then adding inorganic colloidal particles into the epoxy resin and methyl methacrylate mixed system and stirring uniformly;

[0028] (3) Mixing the solutions of step (1) and step (2), then adding spinel after electronic transition, rare earth element oxide and stabilizer and stirring evenly, the coating for heat dissipation on the surface of the LED heat sink can be obtained.

[0029] The above-mentioned spinel electron radiation has an energy range of 1-1.5MeV, and electron irradiation under the condition of a beam power of 2-20Kw for 0.2-3h to realize electron transition. Spinel is ground to a particle size of less than 1000 nm after electronic transition.

[0030] Table 1 embodiment 1-3 dosage of each component

[0031]

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Abstract

The invention discloses a coating for cooling the surface of a light-emitting diode (LED) radiator. The coating is characterized by being prepared from the following components in parts by weight: 6-20 parts of inorganic colloidal particle, 0.5-2 parts of carbon nano-tube, 15-80 parts of electron transition spinel, 0.05-2 parts of rare-earth element oxide, 0.1-0.3 parts of stabilizer, 3-10 parts of epoxy resin, 3-10 parts of methyl methacrylate and 2-5 parts of ethylene glycol. The coating has obvious heat dissipating and cooling effects, is not affected by surrounding medium when taking the cooling effect, can be used in a vacuum environment, also has the advantages of good self-cleaning property, corrosion resistance, waterproofness, fire retardancy, insulativity, and acid and alkali resistance, and convenient construction when taking a radiation cooling effect.

Description

technical field [0001] The invention relates to the technical field of coatings for cooling the surface of an LED radiator, in particular to a coating for heat dissipation on the surface of an LED radiator. technical background [0002] With the higher requirements of energy saving, emission reduction and environmental protection, more and more LED light sources are now used to replace traditional light sources; however, high-power LED light sources generate a large amount of heat, and if the heat dissipation is not timely, it is easy to have a great impact on the life of LED light sources. influences. The LED light source and the substrate are connected by bonding and welding. The traditional heat dissipation mainly uses heat-dissipating resin at the bonding place to dissipate heat. However, as the temperature of the bonding place changes repeatedly, it is easy to affect the performance of the resin, causing the resin to age and peel off. , the heat dissipation effect is p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D4/02C09D5/33
Inventor 戴文良
Owner NINGBO AISHI ELECTRIC EQUIP
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