Method and system for detecting wafer distribution range and storage medium

Abstract

The invention provides a method and system for detecting a wafer distribution range and a storage medium. The method comprises steps of 1, a data receiving step, receiving an image which is an image formed by photographing a wafer disc through a camera; 2, an image processing step, carrying out opening operation on the image, and removing single points in the image; performing closing operation on the image, and connecting adjacent areas in the image together; step 3, an image analysis step, finding out all closed areas in the image, and finding out corresponding contours; step 4, a searching step, after the line-by-line searching of the first closed area in the image is completed, jumping to the next closed area to perform the line-by-line searching till the searching of all closed areas is completed; and 5, recording, recording the search result in the step 4. The method is advantaged in that discontinuous closed areas can be quickly traversed without duplication or missing, and blank areas can be directly skipped without detection, so search areas are greatly reduced, and working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of wafer bonding, in particular to a method, system and storage medium for detecting the distribution range of wafers. Background technique [0002] In the die-bonding equipment, there is an essential premise that the precise position of each wafer in the wafer tray must be known before the next step can be performed. During the process of expanding the wafer, the overall wafer will be shifted, and the relative position between the wafers will change randomly. Currently, machine vision is used to adapt to this situation. [0003] As the wafers are getting smaller and smaller, in order to ensure the accuracy, only about 30 or less can be taken each time, and only the most central one is taken each time, while there are tens of thousands of wafers in a whole plate. In order to get it clean, you can only check it in all possible places, so that more than half of the time is running empty, and the time cost is ...

AI Technical Summary

Problems solved by technology

In order to get it clean, you can only check it in all possible places, so that more than half of the time is running empty, and the time cost is too high; and for efficiency, selectively skip blank positions, so that those island areas will be skipped Not taking it will cause a waste of wafers, which is also unacceptable to all manufacturers

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