Vapor chamber
A technology of vapor chamber and capillary structure, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, heat exchange equipment, etc., and can solve the problem of heat dissipation efficiency failure of the vapor chamber, accumulation in a narrow area or difficulty in passing through a narrow area and reflowing To the position where the vapor chamber is in thermal contact with the heat source, etc., to achieve the effect of improving the heat dissipation capacity
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[0049] see Figure 1 to Figure 4 . figure 1 It is a perspective view of the temperature chamber according to the first embodiment of the present invention. figure 2 for figure 1 A perspective view of the vapor chamber of . image 3 for figure 1 Plan view of the vapor chamber with the second cover removed. Figure 4 for figure 1 sectional view.
[0050] The vapor chamber 10 of this embodiment is used for accommodating a cooling fluid (not shown in the figure). The vapor chamber 10 includes a first cover 100 , a second cover 200 , a first capillary structure 300 and a second capillary structure 400 .
[0051] The material of the first cover 100 and the second cover 200 is, for example, oxygen-free copper, silicon-containing alloy copper or phosphorus-containing alloy copper plate, and the second cover 200 and the first cover 100 are joined together to form a liquid-tight The space S, the liquid-tight space S is used to accommodate cooling fluid (not shown in the figure)...
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