A kind of high thermal conductivity polymer composite thermal conductive material and preparation method thereof

A high-molecular polymer and composite heat-conducting material technology, which is applied in sustainable manufacturing/processing, climate sustainability, chemical industry, etc., can solve the problems of MXene’s unsatisfactory thermal conductivity, and achieve easy operation, easy uniform dispersion, and heat conduction The effect of excellent performance

Active Publication Date: 2022-07-08
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, the application of MXene in the field of thermal conductivity is still less, because of its excellent thermal conductivity, and there are more functional groups on its surface, such as -F, -OH, -O, etc., which can have a better compatibility with the polymer matrix. Capacitive, can be used as an ideal filler for high thermal conductivity polymer composites, but the thermal conductivity of pure MXene is not ideal

Method used

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  • A kind of high thermal conductivity polymer composite thermal conductive material and preparation method thereof
  • A kind of high thermal conductivity polymer composite thermal conductive material and preparation method thereof
  • A kind of high thermal conductivity polymer composite thermal conductive material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Preparation of an Ag / MXene Flake Composite

[0031] S1. Weigh a certain amount of Ti 3 AlC 2 (MAX) powder, slowly add 50ml of 40% HF solution into a polytetrafluoroethylene beaker, heat and stir for 24h at a water bath temperature of 60°C, and centrifuge with deionized water after the etching is completed. Wash until the pH of the solution is 6, and vacuum dry the centrifuged powder at 60°C for 24h to obtain multilayer Ti 3 C 2 T x (MXene) powder;

[0032] S2, take 2g multilayer Ti 3 C 2 T xThe powder was added to 30 ml of dimethyl sulfoxide (DMSO) solution, stirred at room temperature for 24 hours, and then repeatedly centrifuged and washed with deionized water and ethanol for several times to remove the DMSO solvent to obtain a sticky precipitate, which was dispersed in deoxygenated deionized water, Protected with flowing argon, ultrasonically dispersed in an ultrasonic cleaner, the ultrasonic suspension was filtered with a polytetrafluoroethylene (PVDF) membr...

Embodiment 2

[0035] Preparation of an Ag / MXene Flake Composite

[0036] Compared with Example 1, the only difference is that S3 is different, and the rest are the same, specifically: S3, weigh a certain amount of AgNO 3 AgNO was prepared by dissolving in 50ml deionized water 3 solution, 1g Ti 3 C 2 T x The flakes are slowly added to the above AgNO 3 The solution was stirred at room temperature for 3 h, and then centrifuged and washed to remove excess Ag + , and finally the washed product was dried in a vacuum drying oven at 60 °C for 24 hours to obtain Ag / Ti with an Ag content of 0.2 wt%. 3 C 2 T x Thin sheet composites.

Embodiment 3

[0038] Preparation of an Ag / MXene Flake Composite

[0039] Compared with Example 1, the only difference is that S3 is different, and the rest are the same, specifically: S3, weigh a certain amount of AgNO 3 AgNO was prepared by dissolving in 50ml deionized water 3 solution, 1g Ti 3 C 2 T x The flakes are slowly added to the above AgNO 3 The solution was stirred at room temperature for 9 h, and then centrifuged and washed to remove excess Ag + , and finally the washed product was dried in a vacuum drying oven at 60 °C for 24 hours to obtain Ag / Ti with an Ag content of 2.0 wt%. 3 C 2 T x Thin sheet composites.

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Abstract

The invention discloses a high thermal conductivity polymer composite heat-conducting material and a preparation method thereof, and relates to the technical field of heat-conducting materials. Disclosed is a method for preparing a high thermal conductivity polymer polymer composite thermally conductive material. The steps are as follows: the Ag / MXene sheet composite material is dispersed in an organic solvent, then added to a polyurethane prepolymer, heated and stirred in a protective atmosphere Disperse; add polyisocyanate and catalyst to the above reaction system, heat up, stir and react, remove air bubbles from the mixed material, pour it into a mold, and solidify it. In the invention, the Ag / MXene sheet composite material is added to the matrix of the high molecular polymer thermal conductive material such as polyurethane, which can significantly improve the thermal conductivity of the material, and can be applied to electronic packaging materials; and the preparation method is effective and controllable, and is economical and environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of thermally conductive materials, in particular to a high thermally conductive polymer composite thermally conductive material and a preparation method thereof. Background technique [0002] With the rapid development of electronic integration technology, electronic components and electronic equipment are becoming more and more small, light and thin. However, with the continuous increase of operating frequency, electronic devices will inevitably generate a large amount of electrical power loss due to electrical power loss. Heat makes the operating temperature of electronic device circuits continue to rise, which leads to the failure of some temperature-sensitive components. Therefore, the development of heat-dissipating materials with high thermal conductivity is an urgent problem to be solved. [0003] Traditional polymer materials have the advantages of light weight, good processing performance, good ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L75/04C08L27/16C08L63/00C08K9/02C08K3/28C08K3/14C08K3/08
CPCC08K9/02C08K3/28C08K3/14C08K3/08C08K2201/011C08K2003/0806C08L2203/206C08L75/04C08L27/16C08L63/00Y02P20/10
Inventor 蔡梦蝶陈京帅魏宇学孙松
Owner ANHUI UNIVERSITY
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