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LED chip transfer method

A technology of LED chip and transfer method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of low transfer efficiency of small-sized LED chips, and achieve the effect of simple and efficient LED chip transfer

Active Publication Date: 2021-07-16
TCL CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a LED chip transfer method to solve the problem of low transfer efficiency of small-sized LED chips

Method used

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Embodiment Construction

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention discloses an LED chip transfer method. A donor substrate which is transparent to light rays is arranged, the light rays are incident through light holes which are formed in a light cover in an array mode, after the donor substrate absorbs the light rays, LED chips which correspond to the light holes in a one-to-one mode fall off and are transferred to a target substrate, and the transfer mode is not affected by the sizes of the LED chips; and batch small-sized LED chip transfer can be efficiently and simply realized, and the batch production requirement of display equipment can be met without limitation.

Description

technical field [0001] The invention belongs to the field of LED manufacturing, and more specifically relates to a LED chip transfer method. Background technique [0002] As a self-illuminating light source, LED chips (grains) have a great potential to be used in the display field. However, traditional LED chips are bulky and require high cost when used in the display field. At the same time, the pixel density is also low, so they are generally concentrated in commercial use. It can be seen that the miniaturization of the LED chip can not only significantly reduce the cost of the chip, but also enable the LED chip array to have a higher pixel density. Therefore, the miniaturization of LED chips can promote their wide application in display technology. [0003] The current miniaturization of LED chips is mainly used in Mini-LED and Micro-LED. However, a major problem faced after the miniaturization of LED chips is how to transfer the chips in an orderly manner. The tradit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L27/15
CPCH01L21/67144H01L21/6835H01L27/156H01L2221/68313
Inventor 林智远谢相伟
Owner TCL CORPORATION
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