Method and device for manufacturing LED lamp strip circuit board through single-face roller coating

Abstract

The invention discloses a method and device for manufacturing an LED lamp strip circuit board through single-face roller coating, and belongs to the technical field of LED lamp strip circuit boards. The method comprises the steps of base material combination, front circuit layer manufacturing, via hole manufacturing, via hole metallization and surface copper thickening manufacturing, product conduction performance detection, surface insulation layer manufacturing, character layer manufacturing, bonding pad surface treatment, appearance manufacturing, finished product inspection and detection and the like. The rotary drum is driven by a rotary table on one side to rotate, limiting plate assemblies are arranged on a supporting bottom plate of the rotary drum in an annular array mode to limit a circuit board workpiece, a drainage channel is formed in the center of the supporting bottom plate, a water collecting barrel is arranged below the drainage channel, and the drainage channel is connected with a bottom plate of the water collecting barrel through a bearing. A water pump is arranged in the water collecting cylinder and connected with a backflow pipe, a filtering assembly is arranged on the backflow pipe, the backflow pipe is communicated with a cleaning water pipe, and a water outlet pipe with a nozzle is connected to the cleaning water pipe.

Description

technical field [0001] The invention relates to the technical field of LED strip circuit boards, in particular to a method and device for manufacturing LDE strip circuit boards by coating with a single-sided roller. Background technique [0002] With the development of science and technology, LED lighting has become the main lighting method. As the main subdivided product of LED lighting, the light strip is expanding year by year. The circuit board is used as the carrier of circuit transmission and component welding of LED and other light strip products. It plays a key role in realizing the application of LED products. [0003] At present, the double-sided panels with plated through holes for LED strips in the industry use the traditional layer-reduction process to complete material cutting (base material production), drilling (via hole production), chemical via holes and copper plating (via hole metallization) Copper thickening on the surface) to the production process of ...

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Problems solved by technology

[0004] When the double-sided base material used in the production process of the prior art undergoes circuit pattern production after the entire board is electroplated with copper, about 20-40% of the area of ​​copper-plated thickened copper foil will be used as an invalid area when the circuit pattern is etched It is removed by chemical corrosion, and the waste of copper resources is relatively large; and due to the use of full-format electroplating during electroplating, both the effective area and the invalid area require electroplating energy and waste a lot. In order to realize the required circuit pattern, it is necessary to perform double-sided etching to remove the copper foil in the invalid area. , consumes a lot of energy and resources and increases pollutants

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