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Face detection chip for face recognition device

A technology of face recognition and face detection, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., and can solve the problem of no bending and breaking of pins, no external impact protection, no flexible adjustment of installation position, etc. problem, to achieve the effect of protection against bending and fracture, stable installation, and flexible adjustment of installation position

Active Publication Date: 2021-07-16
法诺信息产业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a face detection chip for a face recognition device, to solve the above-mentioned background technology that does not have the function of protecting the pins from bending and breaking, does not have the function of flexibly adjusting the installation position, and does not have the function of external impact. The problem of the function of protection

Method used

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  • Face detection chip for face recognition device
  • Face detection chip for face recognition device
  • Face detection chip for face recognition device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: See Figure 1-6 , a face detection chip for a face recognition device, comprising a semiconductor chip 1, a plurality of groups of metal pins 2 are uniformly arranged on the bottom of the semiconductor chip 1, and a pin protection structure is arranged on the bottom of the semiconductor chip 1;

[0031] see Figure 1-6 A face detection chip for a face recognition device also includes a stitch protection structure, the stitch protection structure includes a hard substrate 3, the hard substrate 3 is fixedly connected to the bottom end of the semiconductor chip 1, and the bottom end of the hard substrate 3 is fixedly connected to a The silicone cushion 4, the hard substrate 3 and the silicone cushion 4 are respectively provided with multiple groups of pinholes 5, and the two sides of the low end of the silicone cushion 4 are respectively fixedly connected with fixing bolts 6;

[0032] Silicone cushions 4 are arranged at equal intervals;

[0033] The inner diam...

Embodiment 2

[0036] Embodiment 2: The outside of the semiconductor chip 1 is provided with an adjustable mounting structure 7. The adjustable mounting structure 7 is composed of a mounting plate 701, a mounting screw groove 702, an anti-wear washer 703 and a mounting screw 704. The mounting plate 701 is sleeved on the semiconductor chip. 1, the insides of both sides of the mounting plate 701 are respectively provided with mounting screw grooves 702, the inside of the mounting screw grooves 702 is provided with anti-wear washers 703, and the inside of the mounting screw grooves 702 is inserted with mounting screws 704;

[0037] The outer diameter of the anti-wear washer 703 is consistent with the inner diameter of the mounting screw groove 702;

[0038] The mounting screw grooves 702 are distributed symmetrically about the vertical center line of the mounting plate 701;

[0039] Specifically, such as figure 1 , Figure 4 and Figure 5 As shown, the mounting plate 701 serves as the base o...

Embodiment 3

[0040] Embodiment 3: The top of the semiconductor chip 1 is provided with a top protective structure 8, the top protective structure 8 is composed of a protective net 801, a cooling hole 802, a silica gel column 803 and a side frame 804, the protective net 801 is arranged on the top of the semiconductor chip 1, and the protection The inside of the net 801 is uniformly provided with cooling holes 802, the two sides of the bottom of the protective net 801 are respectively fixedly connected with silica gel posts 803, and the bottom of the protective net 801 is fixedly connected with side frames 804;

[0041] Silica gel columns 803 are symmetrically distributed about the vertical centerline of the protective net 801;

[0042] Specifically, such as figure 1 and Figure 6As shown, when the impact on the top comes, the protective net 801 directly bears the pressure and transmits the impact force to the silica gel column 803, and the soft silica gel column 803 shrinks to reduce the f...

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Abstract

The invention discloses a face detection chip for a face recognition device, and particularly relates to the technical field of electronic chips. The face detection chip comprises a semiconductor chip, an adjustable mounting structure is arranged outside the semiconductor chip, a top protection structure is arranged at the top end of the semiconductor chip, and a pin protection structure is arranged at the bottom end of the semiconductor chip. According to the invention, a hard substrate, a silica gel cushion, pin holes and fixing bolts are arranged, during use, the hard substrate is used as a base and is firmly fixed at the bottom end of the semiconductor chip, and the pin holes in the hard substrate play roles in protecting and fixing the root parts of the metal pins so that the metal pins are prevented from being broken under the action of an external force, the silica gel cushion at the bottom of the hard substrate plays a buffering role, the silica gel cushion absorbs pressure under the action of top pressure and can prevent the metal pins from being bent, the fixing bolts can enable the whole structure to be firmly attached and stably installed, and the functions of protecting the pins and preventing the pins from being bent and broken are achieved.

Description

technical field [0001] The invention relates to the technical field of electronic chips, in particular to a face detection chip for a face recognition device. Background technique [0002] With the development of science and technology and the progress of society, the application of electronic information technology in daily life is becoming more and more extensive, especially the face recognition technology, which has developed rapidly in recent years, has mature applications in the fields of security, travel and payment. Conditions, in a wide variety of face recognition devices, smart chips are an indispensable and important component. Traditional chips can only meet the needs of function realization, and there are still deficiencies in other aspects that need to be improved. [0003] In the process of realizing the present invention, the inventors have found that at least the following problems in the prior art have not been resolved: [0004] (1) The face detection chip...

Claims

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Application Information

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IPC IPC(8): H01L23/12H01L23/367H01L23/00
CPCH01L23/12H01L23/367H01L23/562
Inventor 牛桂平
Owner 法诺信息产业有限公司
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